Electrochemical Fabrication Methods Including Use of Surface Treatments to Reduce Overplating and/or Planarization During Formation of Multi-layer Three-Dimensional Structures

Abstract

A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e.g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.

1 . A method for forming at least a portion of a three-dimensional structure from a plurality of stacked and adhered layers, comprising:
 (a) depositing and patterning a first conductive material on a substrate or previous layer to obtain a desired pattern having at least one protrusion of the first conductive material having a surface and at least one opening extending from the surface through a thickness of the first conductive material to the substrate or previously formed layer;   (b) treating the surface of the first conductive material to decrease susceptibility of the surface to receive a second conductive material which is to be deposited;   (c) depositing the second conductive material, such that deposition occurs with a higher selectivity to one or more regions defined by the at least one opening, wherein the selectivity results, at least in part, from the treating of the surface of the first conductive material;   (d) removing the effect of the treating of the surface of the first conductive material;   (e) repeating elements (a)-(d) such that a plurality of stacked layers are adhered to successively formed layers to form the at least portion of the three-dimensional structure.