Inventor · disambiguated record
Jan Edward Vandemeer
Also filed as: VANDEMEER JAN · VANDEMEER JAN E · VANDEMEER JAN EDWARD
12 granted patents·2 pending applications·47 citations·filing 2004–2018
87Inventor score
Files withQORVO US INC5RF MICRO DEVICES INC5AKUSTICA INC1DIAMOND BRETT M1FREESCALE SEMICONDUCTOR INC1
Top patents by PatentIndex Score
14 records- 0189US7640805B2Proof-mass with supporting structure on integrated circuit-MEMS platformAKUSTICA INC·Filed 2006·Granted Jan 5, 2010·20 cites·22 claims
- 0279US8314467B1Thermally tolerant electromechanical actuatorsHAMMOND JONATHAN HALE·Filed 2010·Granted Nov 20, 2012·3 cites·18 claims
- 0379US8094980B2Proof-mass with supporting structure on integrated circuit-MEMS platform and method of fabricating the sameDIAMOND BRETT M·Filed 2010·Granted Jan 10, 2012·6 cites·21 claims
- 0472US10038055B2Substrate structure with embedded layer for post-processing silicon handle eliminationQORVO US INC·Filed 2017·Granted Jul 31, 2018·1 cites·20 claims
- 0569US10486963B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Nov 26, 2019·1 cites·22 claims
- 0666US10486965B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Nov 26, 2019·1 cites·23 claims
- 0764US7000473B2MEM structure having reduced spring stictionFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Feb 21, 2006·15 cites·24 claims
- 0854US10804179B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2018·Granted Oct 13, 2020·0 cites·17 claims
- 0951US10109550B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Oct 23, 2018·0 cites·17 claims
- 1047US2016343604A1Substrate structure with embedded layer for post-processing silicon handle eliminationRF MICRO DEVICES INC·Filed 2016·Application pending·0 cites
- 1144US9806192B2Suppression of back-gate transistors in RF CMOS switches built on an SOI substrateRF MICRO DEVICES INC·Filed 2016·Granted Oct 31, 2017·0 cites·20 claims
- 1234US9688529B2Glass wafer assemblyRF MICRO DEVICES INC·Filed 2015·Granted Jun 27, 2017·0 cites·5 claims
- 1333US10759660B2Method for processing product wafers using carrier substratesRF MICRO DEVICES INC·Filed 2015·Granted Sep 1, 2020·0 cites·16 claims
- 1433US2016219704A1Hermetically sealed through vias (tvs)RF MICRO DEVICES INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →