Inventor · disambiguated record
Kouta Noda
Also filed as: NODA KOUTA
17 granted patents·3 pending applications·886 citations·filing 1990–2012
96Inventor score
Top patents by PatentIndex Score
20 records- 0197US8148643B2Multilayered printed circuit board and manufacturing method thereofHIROSE NAOHIRO·Filed 2007·Granted Apr 3, 2012·56 cites·10 claims
- 0297US7691189B2Printed wiring board and its manufacturing methodIBIDEN CO LTD·Filed 2007·Granted Apr 6, 2010·57 cites·18 claims
- 0397US6591495B2Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic platingIBIDEN CO LTD·Filed 2001·Granted Jul 15, 2003·102 cites·5 claims
- 0497US6376052B1Multilayer printed wiring board and its production process, resin composition for filling through-holeIBIDEN CO LTD·Filed 2000·Granted Apr 23, 2002·117 cites·55 claims
- 0594US6376049B1Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-holeIBIDEN CO LTD·Filed 1990·Granted Apr 23, 2002·82 cites·86 claims
- 0693US8065794B2Printed wiring board and its manufacturing methodEN HONCHIN·Filed 2008·Granted Nov 29, 2011·26 cites·1 claims
- 0791US7415761B2Method of manufacturing multilayered circuit boardIBIDEN CO LTD·Filed 2003·Granted Aug 26, 2008·35 cites·9 claims
- 0888US6248428B1Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring boardIBIDEN CO LTD·Filed 1998·Granted Jun 19, 2001·74 cites·39 claims
- 0987US7832098B2Method of manufacturing a multilayered printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Nov 16, 2010·10 cites·10 claims
- 1084US7230188B1Printed wiring board and its manufacturing methodIBIDEN CO LTD·Filed 1999·Granted Jun 12, 2007·55 cites·16 claims
- 1183US6762921B1Multilayer printed-circuit board and method of manufactureIBIDEN CO LTD·Filed 1999·Granted Jul 13, 2004·52 cites·14 claims
- 1281US5841190AHigh density multi-layered printed wiring board, multi-chip carrier and semiconductor packageIBIDEN CO LTD·Filed 1995·Granted Nov 24, 1998·75 cites·23 claims
- 1380US8021748B2Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing sameIBIDEN CO LTD·Filed 2004·Granted Sep 20, 2011·17 cites·10 claims
- 1480US6261671B1Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring boardIBIDEN CO LTD·Filed 1998·Granted Jul 17, 2001·52 cites·30 claims
- 1577US6512186B1Multilayer printed wiring board having a roughened inner conductor layer and production method thereofIBIDEN CO LTD·Filed 1999·Granted Jan 28, 2003·45 cites·10 claims
- 1669US7827680B2Electroplating process of electroplating an elecrically conductive sustrateIBIDEN CO LTD·Filed 2004·Granted Nov 9, 2010·11 cites·1 claims
- 1765USRE40947EMultilayer printed wiring board and its manufacturing method, and resin composition for filling through-holeIBIDEN CO LTD·Filed 1990·Granted Oct 27, 2009·20 cites·112 claims
- 1855US2008014336A1Interlayer dielectric layer for printed wiring board, printed wiring board, and method of producing the sameIBIDEN CO LTD·Filed 2007·Application pending·0 cites
- 1955US2008023815A1Interlayer dielectric layer for printed wiring board, printed wiring board, and method of producing the sameIBIDEN CO LTD·Filed 2007·Application pending·0 cites
- 2052US2012125680A1Multilayered printed circuit board and manufacturing method thereofHIROSE NAOHIRO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →