Inventor · disambiguated record
Xu Sheng Bao
Also filed as: BAO XU · BAO XU SHENG
10 granted patents·2 pending applications·67 citations·filing 2007–2023
86Inventor score
Files withSHENZHEN SENSETIME TECHNOLOGY CO LTD4STATS CHIPPAC LTD4STATS CHIPPAC PTE LTD2HUAWEI TECH CO LTD1THE 28TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION1
Top patents by PatentIndex Score
12 records- 0194US9685350B2Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLBSTATS CHIPPAC LTD·Filed 2014·Granted Jun 20, 2017·16 cites·6 claims
- 0294US7667335B2Semiconductor package with passivation island for reducing stress on solder bumpsSTATS CHIPPAC LTD·Filed 2007·Granted Feb 23, 2010·37 cites·14 claims
- 0387US7968445B2Semiconductor package with passivation island for reducing stress on solder bumpsSTATS CHIPPAC LTD·Filed 2010·Granted Jun 28, 2011·9 cites·25 claims
- 0472US10972709B2Image processing method and apparatus, electronic device, and computer storage mediumSHENZHEN SENSETIME TECHNOLOGY CO LTD·Filed 2019·Granted Apr 6, 2021·2 cites·18 claims
- 0570US10741416B2Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLBSTATS CHIPPAC PTE LTD·Filed 2017·Granted Aug 11, 2020·1 cites·25 claims
- 0669US11250241B2Face image processing methods and apparatuses, and electronic devicesSHENZHEN SENSETIME TECHNOLOGY CO LTD·Filed 2019·Granted Feb 15, 2022·2 cites·19 claims
- 0766US11488838B2Semiconductor device having an embedded conductive layer for power/ground planes in Fo-eWLBSTATS CHIPPAC PTE LTD·Filed 2020·Granted Nov 1, 2022·0 cites·25 claims
- 0860US2022083763A1Face image processing methods and apparatuses, and electronic devicesSHENZHEN SENSETIME TECHNOLOGY CO LTD·Filed 2021·Application pending·0 cites
- 0959US2023289183A1Operator calculation method, apparatus, device, and systemHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 1055US9620557B2Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity regionSTATS CHIPPAC LTD·Filed 2015·Granted Apr 11, 2017·0 cites·20 claims
- 1152US11710416B2Multi-dimensional flight release efficiency evaluation methodTHE 28TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2022·Granted Jul 25, 2023·0 cites·1 claims
- 1239US11132824B2Face image processing method and apparatus, and electronic deviceSHENZHEN SENSETIME TECHNOLOGY CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →