Inventor · disambiguated record
Chin-Ti Chen
Also filed as: CHEN CHIN-TI
9 granted patents·10 pending applications·47 citations·filing 1994–2012
84Inventor score
Files withPOWERTECH TECHNOLOGY INC9ACADEMIA SINICA4CHEN CHIN-TI4AU OPTRONICS CORP1CALIFORNIA INST OF TECHN1
Top patents by PatentIndex Score
19 records- 0185US7564123B1Semiconductor package with fastened leadsPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Jul 21, 2009·16 cites·20 claims
- 0282US7884472B2Semiconductor package having substrate ID code and its fabricating methodPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Feb 8, 2011·13 cites·6 claims
- 0374US7786568B2Window BGA semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Aug 31, 2010·7 cites·13 claims
- 0460US5500156AUnsymmetrical squaraines for nonlinear optical materialsCALIFORNIA INST OF TECHN·Filed 1994·Granted Mar 19, 1996·7 cites·28 claims
- 0559US7052783B2Oxadiazole tetramersACADEMIA SINICA·Filed 2001·Granted May 30, 2006·3 cites·18 claims
- 0656US7549568B1Method of forming identification code for wire-bonding machinesPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Jun 23, 2009·1 cites·10 claims
- 0752US9240555B2Organic luminescent material and organic electroluminescent apparatusAU OPTRONICS CORP·Filed 2012·Granted Jan 19, 2016·0 cites·12 claims
- 0845US2009298233A1Method for Fabricating Semiconductor ElementsPOWERTECH TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 0944US2009294933A1Lead Frame and Chip Package Structure and Method for Fabricating the SamePOWERTECH TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 1043US2009137083A1Assembling of doubled-side stacking pulral chipsPOWERTECH TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 1142US7005519B1Tetraazaporphyrin compoundsACADEMIA SINICA·Filed 2004·Granted Feb 28, 2006·0 cites·25 claims
- 1242US2009243055A1Leadframe, semiconductor packaging structure and manufacturing method thereofCHEN CHIN-TI·Filed 2008·Application pending·0 cites
- 1342US2009236710A1Col semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 1442US2009243059A1Semiconductor package structureCHEN CHIN-TI·Filed 2008·Application pending·0 cites
- 1542US2009261463A1Chip mounting device and chip package arrayCHEN CHIN-TI·Filed 2008·Application pending·0 cites
- 1641US2008303130A1Package on package structureCHEN CHIN-TI·Filed 2008·Application pending·0 cites
- 1741US2008042255A1Chip package structure and fabrication method thereofPOWERTECH TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 1838US2007173657A1Tetraphenylsilane-carbazole compound, its preparation method and its use as host material for dopants of organic light emitting diodeACADEMIA SINICA·Filed 2006·Application pending·0 cites
- 1926US6884525B2Red light emitting materialsACADEMIA SINICA·Filed 2002·Granted Apr 26, 2005·0 cites·46 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →