Assignee
CHEN CHIN-TI
0 granted patents·4 pending applications·0 citations·filing 2008–2008
Top patents by PatentIndex Score
4 records- 0142US2009243055A1Leadframe, semiconductor packaging structure and manufacturing method thereofCHEN CHIN-TI·Filed 2008·Application pending·0 cites
- 0242US2009243059A1Semiconductor package structureCHEN CHIN-TI·Filed 2008·Application pending·0 cites
- 0342US2009261463A1Chip mounting device and chip package arrayCHEN CHIN-TI·Filed 2008·Application pending·0 cites
- 0441US2008303130A1Package on package structureCHEN CHIN-TI·Filed 2008·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when CHEN CHIN-TI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →