Inventor · disambiguated record
Sung-Mao Wu
Also filed as: WU SUNG C · WU SUNG M · WU SUNG-MAO
10 granted patents·13 pending applications·36 citations·filing 2003–2012
85Inventor score
Top patents by PatentIndex Score
23 records- 0179US7248134B2Inductor and capacitor formed of build-up viasADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jul 24, 2007·8 cites·6 claims
- 0275US9276548B2Stacked LC resonator and band pass filter using the sameUNIV NAT SUN YAT SEN·Filed 2012·Granted Mar 1, 2016·3 cites·9 claims
- 0370US6933605B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 23, 2005·14 cites·7 claims
- 0466US7945062B2Microelectromechanical microphone packaging systemADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 17, 2011·3 cites·7 claims
- 0550US7084639B2Impedance standard substrate and method for calibrating vector network analyzerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 1, 2006·4 cites·13 claims
- 0646US7072780B2Impedance standard substrate and correction method for vector network analyzerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 4, 2006·3 cites·10 claims
- 0745US2005189641A1Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 0842US7352056B2Semiconductor package structure with microstrip antennanADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 1, 2008·1 cites·16 claims
- 0942US7053627B2Impedance standard substrate and method for calibrating vector network analyzerADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 30, 2006·0 cites·11 claims
- 1042US2008093116A1Semiconductor substrate for transmitting differential pairADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1142US2007267758A1Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1242US2008093702A1Semiconductor device having a passive deviceADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1341US7199445B2Integrated capacitor on packaging substrateADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Apr 3, 2007·0 cites·15 claims
- 1441US2005046046A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 1540US2006108690A1Circuit board with reduced simultaneous switching noiseADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 1640US2010265009A1Stacked lc resonator and bandpass filter of using the sameUNIV NAT SUN YAT SEN·Filed 2009·Application pending·0 cites
- 1739US7061347B2High frequency substrate comprised of dielectric layers of different dielectric coefficientsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 13, 2006·0 cites·9 claims
- 1839US2004089929A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 1936US2004124955A1High frequency substrateFiled 2003·Application pending·0 cites
- 2034US2005164542A1Connector with high performance transmission effectFiled 2004·Application pending·0 cites
- 2134US2004104044A1[printed circuit board design]Filed 2003·Application pending·0 cites
- 2232US2004124541A1Flip chip packageFiled 2003·Application pending·0 cites
- 2330US2004059739A1Online IC package searching systemFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →