Inventor · disambiguated record
Hsiu-Jen Wang
Also filed as: WANG HSIU-JEN
7 granted patents·2 pending applications·5 citations·filing 2018–2025
73Inventor score
Files withAPPLIED MATERIALS INC9
Top patents by PatentIndex Score
9 records- 0188US10948834B2Dynamic imaging systemAPPLIED MATERIALS INC·Filed 2020·Granted Mar 16, 2021·2 cites·17 claims
- 0283US10719018B2Dynamic imaging systemAPPLIED MATERIALS INC·Filed 2018·Granted Jul 21, 2020·3 cites·20 claims
- 0380US2025348010A1Package imaging for die location correction in digital lithographyAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0474US2025076753A1Advanced-packaging high-volume-mode digital-lithography-toolAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0572US12032284B2Advanced-packaging high-volume-mode digital-lithography-toolAPPLIED MATERIALS INC·Filed 2022·Granted Jul 9, 2024·0 cites·18 claims
- 0670US12379676B2Package imaging for die location correction in digital lithographyAPPLIED MATERIALS INC·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 0750US10928743B2Multi-substrate processing on digital lithography systemsAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
- 0849US10459341B2Multi-configuration digital lithography systemAPPLIED MATERIALS INC·Filed 2018·Granted Oct 29, 2019·0 cites·17 claims
- 0947US12381103B2Multiple substrate handling system and methodAPPLIED MATERIALS INC·Filed 2021·Granted Aug 5, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →