Inventor · disambiguated record
Jeng-Dar Ko
Also filed as: KO JENG-DAR
8 granted patents·126 citations·filing 2005–2015
85Inventor score
Top patents by PatentIndex Score
8 records- 0197US7294920B2Wafer-leveled chip packaging structure and method thereofIND TECH RES INST·Filed 2005·Granted Nov 13, 2007·92 cites·5 claims
- 0292US7528009B2Wafer-leveled chip packaging structure and method thereofIND TECH RES INST·Filed 2007·Granted May 5, 2009·20 cites·18 claims
- 0380US8314482B2Semiconductor package deviceCHEN SHOU-LUNG·Filed 2007·Granted Nov 20, 2012·8 cites·20 claims
- 0471US9059181B2Wafer leveled chip packaging structure and method thereofINVENSAS CORP·Filed 2013·Granted Jun 16, 2015·2 cites·14 claims
- 0567US7632707B2Electronic device package and method of manufacturing the sameIND TECH RES INST·Filed 2005·Granted Dec 15, 2009·3 cites·8 claims
- 0664US8587091B2Wafer-leveled chip packaging structure and method thereofCHEN SHOU-LUNG·Filed 2012·Granted Nov 19, 2013·1 cites·4 claims
- 0754US7838333B2Electronic device package and method of manufacturing the sameIND TECH RES INST·Filed 2009·Granted Nov 23, 2010·0 cites·18 claims
- 0836US9601474B2Electrically stackable semiconductor wafer and chip packagesINVENSAS CORP·Filed 2015·Granted Mar 21, 2017·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →