Inventor · disambiguated record
Junji Shiota
Also filed as: SHIOTA JUNJI
15 granted patents·4 pending applications·271 citations·filing 1983–2016
93Inventor score
Top patents by PatentIndex Score
19 records- 0189US4975168AMethod of forming transparent conductive film and apparatus for forming the sameCASIO COMPUTER CO LTD·Filed 1989·Granted Dec 4, 1990·78 cites·18 claims
- 0279US5367179AThin-film transistor having electrodes made of aluminum, and an active matrix panel using sameCASIO COMPUTER CO LTD·Filed 1992·Granted Nov 22, 1994·70 cites·19 claims
- 0376US8154133B2Semiconductor device having low dielectric constant film and manufacturing method thereofKOROKU TAISUKE·Filed 2009·Granted Apr 10, 2012·10 cites·10 claims
- 0472US5514259ASputtering apparatusCASIO COMPUTER CO LTD·Filed 1993·Granted May 7, 1996·28 cites·11 claims
- 0567US6368515B1Method of manufacturing ink-jet printer headCASIO COMPUTER CO LTD·Filed 2000·Granted Apr 9, 2002·12 cites·15 claims
- 0666US6473966B1Method of manufacturing ink-jet printer headCASIO COMPUTER CO LTD·Filed 2000·Granted Nov 5, 2002·14 cites·5 claims
- 0766US5259681AEnd separating device for sheet having a backing paperBROTHER IND LTD·Filed 1992·Granted Nov 9, 1993·25 cites·14 claims
- 0863US9607861B2Semiconductor device and method of manufacturing the sameTERA PROBE INC·Filed 2016·Granted Mar 28, 2017·1 cites·10 claims
- 0963US7863750B2Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2009·Granted Jan 4, 2011·3 cites·13 claims
- 1057US4533267ARibbon driving mechanism for typewriterBROTHER IND LTD·Filed 1983·Granted Aug 6, 1985·10 cites·5 claims
- 1154US5441352APrint tape forming apparatus having tape cutting mechanismBROTHER IND LTD·Filed 1994·Granted Aug 15, 1995·12 cites·14 claims
- 1249US2008073785A1Semiconductor device having sealing film and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2007·Application pending·0 cites
- 1348US8354349B2Semiconductor device having sealing film and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2010·Granted Jan 15, 2013·0 cites·13 claims
- 1446US2010144096A1Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective filmCASIO COMPUTER CO LTD·Filed 2009·Application pending·0 cites
- 1545US2010144097A1Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective filmCASIO COMPUTER CO LTD·Filed 2009·Application pending·0 cites
- 1645US2010144095A1Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective filmCASIO COMPUTER CO LTD·Filed 2009·Application pending·0 cites
- 1736US8564128B2Semiconductor device and manufacturing method of the sameSHIOTA JUNJI·Filed 2011·Granted Oct 22, 2013·0 cites·14 claims
- 1836US6320138B1Substrate with conductor formed of low-resistance aluminum alloyCASIO COMPUTER CO LTD·Filed 1998·Granted Nov 20, 2001·6 cites·16 claims
- 1934US4568208APrinterBROTHER IND LTD·Filed 1984·Granted Feb 4, 1986·2 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →