Inventor · disambiguated record
Zhongping Cai
Also filed as: CAI ZHONGPING
6 granted patents·10 citations·filing 2007–2020
73Inventor score
Files withKLA TENCOR CORP2CAI ZHONGPING1KLA TENCOR TECH CORP1PETRENKO ALEKSEY1VELODYNE LIDAR USA INC1
Top patents by PatentIndex Score
6 records- 0170US9097645B2Method and system for high speed height control of a substrate surface within a wafer inspection systemKLA TENCOR CORP·Filed 2014·Granted Aug 4, 2015·4 cites·27 claims
- 0270US9068952B2Method and apparatus for producing and measuring dynamically focussed, steered, and shaped oblique laser illumination for spinning wafer inspection systemPETRENKO ALEKSEY·Filed 2009·Granted Jun 30, 2015·4 cites·9 claims
- 0366US9091666B2Extended defect sizing range for wafer inspectionCAI ZHONGPING·Filed 2012·Granted Jul 28, 2015·2 cites·21 claims
- 0451US12105225B2Systems and methods for calibrating a LiDAR deviceVELODYNE LIDAR USA INC·Filed 2020·Granted Oct 1, 2024·0 cites·16 claims
- 0548US7746462B2Inspection systems and methods for extending the detection range of an inspection system by forcing the photodetector into the non-linear rangeKLA TENCOR TECH CORP·Filed 2007·Granted Jun 29, 2010·0 cites·25 claims
- 0642US9810619B2Method and system for simultaneous tilt and height control of a substrate surface in an inspection systemKLA TENCOR CORP·Filed 2013·Granted Nov 7, 2017·0 cites·45 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →