Inventor · disambiguated record
Anantha R. Sethuraman
Also filed as: SETHURAMAN ANANTHA · SETHURAMAN ANANTHA R
30 granted patents·6 pending applications·901 citations·filing 1995–2023
98Inventor score
Files withAPPLIED MATERIALS INC10CYPRESS SEMICONDUCTOR CORP8KLA TENCOR TECH CORP7RODEL INC7KLA TENCOR TECHNOLOGIES2
Top patents by PatentIndex Score
36 records- 0198US8010222B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2008·Granted Aug 30, 2011·29 cites·10 claims
- 0296US5693239APolishing slurries comprising two abrasive components and methods for their useRODEL INC·Filed 1995·Granted Dec 2, 1997·133 cites·20 claims
- 0394US6218305B1Composition and method for polishing a composite of silica and silicon nitrideRODEL INC·Filed 2000·Granted Apr 17, 2001·72 cites·8 claims
- 0493US6866559B2Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing padKLA TENCOR TECHNOLOGIES·Filed 2003·Granted Mar 15, 2005·31 cites·90 claims
- 0592US7332438B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2006·Granted Feb 19, 2008·11 cites·9 claims
- 0692US6884146B2Systems and methods for characterizing a polishing processKLA TENCOR TECH CORP·Filed 2003·Granted Apr 26, 2005·24 cites·39 claims
- 0792US5738800AComposition and method for polishing a composite of silica and silicon nitrideRODEL INC·Filed 1997·Granted Apr 14, 1998·117 cites·8 claims
- 0891US6671051B1Apparatus and methods for detecting killer particles during chemical mechanical polishingKLA TENCOR·Filed 2000·Granted Dec 30, 2003·49 cites·37 claims
- 0989US10579041B2Semiconductor process control methodAPPLIED MATERIALS INC·Filed 2017·Granted Mar 3, 2020·7 cites·20 claims
- 1087US6042741AComposition for polishing a composite of silica and silicon nitrideRODEL INC·Filed 1998·Granted Mar 28, 2000·74 cites·10 claims
- 1186US6935922B2Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishingKLA TENCOR TECH CORP·Filed 2003·Granted Aug 30, 2005·16 cites·100 claims
- 1284US8831767B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolLEHMAN KURT·Filed 2011·Granted Sep 9, 2014·3 cites·19 claims
- 1384US7030018B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2003·Granted Apr 18, 2006·14 cites·23 claims
- 1482US5972124AMethod for cleaning a surface of a dielectric materialCYPRESS SEMICONDUCTOR CORP·Filed 1998·Granted Oct 26, 1999·55 cites·14 claims
- 1580US7175503B2Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current deviceKLA TENCOR TECH CORP·Filed 2003·Granted Feb 13, 2007·11 cites·47 claims
- 1679US7052369B2Methods and systems for detecting a presence of blobs on a specimen during a polishing processKLA TENCOR TECH CORP·Filed 2003·Granted May 30, 2006·10 cites·38 claims
- 1778US6232231B1Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnectCYPRESS SEMICONDUCTOR CORP·Filed 1998·Granted May 15, 2001·49 cites·16 claims
- 1878US6132637AComposition and method for polishing a composite of silica and silicon nitrideRODEL INC·Filed 1998·Granted Oct 17, 2000·44 cites·8 claims
- 1978US5756398AComposition and method for polishing a composite comprising titaniumRODEL INC·Filed 1997·Granted May 26, 1998·52 cites·17 claims
- 2076US6001269AMethod for polishing a composite comprising an insulator, a metal, and titaniumRODEL INC·Filed 1997·Granted Dec 14, 1999·48 cites·10 claims
- 2174US10481199B2Data analytics and computational analytics for semiconductor process controlAPPLIED MATERIALS INC·Filed 2017·Granted Nov 19, 2019·2 cites·21 claims
- 2268US10579769B2Using design proximity index and effect-to-design proximity ratio to control semiconductor processes and achieve enhanced yieldAPPLIED MATERIALS INC·Filed 2017·Granted Mar 3, 2020·1 cites·19 claims
- 2367US6849946B2Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnectCYPRESS SEMICONDUCTOR CORP·Filed 2001·Granted Feb 1, 2005·10 cites·22 claims
- 2460US6302766B1System for cleaning a surface of a dielectric materialCYPRESS SEMICONDUCTOR CORP·Filed 1999·Granted Oct 16, 2001·20 cites·21 claims
- 2560US2024086597A1Generation and utilization of virtual features for process modelingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2659US2024152675A1Determining substrate characteristics by virtual substrate measurementAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2758US6361415B1Employing an acidic liquid and an abrasive surface to polish a semiconductor topographyCYPRESS SEMICONDUCTOR CORP·Filed 2001·Granted Mar 26, 2002·5 cites·8 claims
- 2851US2006148383A1Methods and systems for detecting a presence of blobs on a specimen during a polishing processKLA TENCOR TECHNOLOGIES·Filed 2006·Application pending·0 cites
- 2951US2023081446A1Using elemental maps information from x-ray energy-dispersive spectroscopy line scan analysis to create process modelsAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 3050US6200896B1Employing an acidic liquid and an abrasive surface to polish a semiconductor topographyCYPRESS SEMICONDUCTOR CORP·Filed 1998·Granted Mar 13, 2001·13 cites·15 claims
- 3148US11187992B2Predictive modeling of metrology in semiconductor processesAPPLIED MATERIALS INC·Filed 2018·Granted Nov 30, 2021·0 cites·18 claims
- 3246US2024054333A1Piecewise functional fitting of substrate profiles for process learningAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3343US10614262B2Method of predicting areas of vulnerable yield in a semiconductor substrateAPPLIED MATERIALS INC·Filed 2017·Granted Apr 7, 2020·0 cites·19 claims
- 3441US11088039B2Data management and mining to correlate wafer alignment, design, defect, process, tool, and metrology dataAPPLIED MATERIALS INC·Filed 2018·Granted Aug 10, 2021·0 cites·21 claims
- 3538US2003219975A1Planarized semiconductor interconnect topography and method for polishing a metal layer to form wide interconnect structuresCYPRESS SEMICONDUCTOR CORP·Filed 2003·Application pending·0 cites
- 3630US6566249B1Planarized semiconductor interconnect topography and method for polishing a metal layer to form wide interconnect structuresCYPRESS SEMICONDUCTOR CORP·Filed 1998·Granted May 20, 2003·1 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →