Inventor · disambiguated record
Xinyun Xia
Also filed as: XIA XINYUN
4 granted patents·4 pending applications·155 citations·filing 2002–2007
81Inventor score
Files withAPPLIED MATERIALS INC8
Top patents by PatentIndex Score
8 records- 0196US7335609B2Gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2005·Granted Feb 26, 2008·70 cites·18 claims
- 0289US7456116B2Gap-fill depositions in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2004·Granted Nov 25, 2008·42 cites·16 claims
- 0381US6905939B2Process for forming silicon oxide materialAPPLIED MATERIALS INC·Filed 2002·Granted Jun 14, 2005·28 cites·5 claims
- 0474US7642171B2Multi-step anneal of thin films for film densification and improved gap-fillAPPLIED MATERIALS INC·Filed 2004·Granted Jan 5, 2010·15 cites·26 claims
- 0551US2008115726A1gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 0649US2007000897A1Multi-step anneal of thin films for film densification and improved gap-fillAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 0744US2007212847A1Multi-step anneal of thin films for film densification and improved gap-fillAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 0836US2005136684A1Gap-fill techniquesAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →