Inventor · disambiguated record
Hyuck-Jin Kang
Also filed as: KANG HYUCK · KANG HYUCK-JIN
5 granted patents·3 pending applications·35 citations·filing 2002–2022
76Inventor score
Top patents by PatentIndex Score
8 records- 0169US6984895B2Bonding pad structure of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 10, 2006·15 cites·7 claims
- 0265US7180154B2Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 20, 2007·15 cites·10 claims
- 0352US6867070B2Bonding pad structure of a semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 15, 2005·5 cites·8 claims
- 0449US11613651B2High heat-resistant composition and method of manufacturing three-dimensional substrate using the sameSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Mar 28, 2023·0 cites·8 claims
- 0549US2023225111A1Semiconductor memory devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0640US2007114635A1Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the sameCHO TAI-HEUI·Filed 2007·Application pending·0 cites
- 0734US7352050B2Fuse region of a semiconductor regionSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 1, 2008·0 cites·9 claims
- 0832US2003008453A1Semiconductor device having a contact window and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →