Inventor · disambiguated record
Michael Yang
Also filed as: YANG MICHAEL · YANG MICHAEL X · YANG MICHAEL XI
47 granted patents·40 pending applications·2,917 citations·filing 1999–2012
99Inventor score
Top patents by PatentIndex Score
87 records- 0198US7094680B2Formation of a tantalum-nitride layerAPPLIED MATERIALS INC·Filed 2005·Granted Aug 22, 2006·59 cites·22 claims
- 0298US6846516B2Multiple precursor cyclical deposition systemAPPLIED MATERIALS INC·Filed 2002·Granted Jan 25, 2005·197 cites·15 claims
- 0398US6423949B1Multi-zone resistive heaterAPPLIED MATERIALS INC·Filed 1999·Granted Jul 23, 2002·534 cites·62 claims
- 0497US7405158B2Methods for depositing tungsten layers employing atomic layer deposition techniquesAPPLIED MATERIALS INC·Filed 2005·Granted Jul 29, 2008·105 cites·29 claims
- 0597US7094685B2Integration of titanium and titanium nitride layersAPPLIED MATERIALS INC·Filed 2005·Granted Aug 22, 2006·34 cites·40 claims
- 0697US7026238B2Reliability barrier integration for Cu applicationAPPLIED MATERIALS INC·Filed 2002·Granted Apr 11, 2006·99 cites·21 claims
- 0797US6998014B2Apparatus and method for plasma assisted depositionAPPLIED MATERIALS INC·Filed 2002·Granted Feb 14, 2006·167 cites·17 claims
- 0897US6951804B2Formation of a tantalum-nitride layerAPPLIED MATERIALS INC·Filed 2001·Granted Oct 4, 2005·106 cites·25 claims
- 0996US7745333B2Methods for depositing tungsten layers employing atomic layer deposition techniquesAPPLIED MATERIALS INC·Filed 2008·Granted Jun 29, 2010·47 cites·15 claims
- 1096US7670465B2Anolyte for copper platingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 2, 2010·33 cites·25 claims
- 1196US7605083B2Formation of composite tungsten filmsAPPLIED MATERIALS INC·Filed 2008·Granted Oct 20, 2009·39 cites·25 claims
- 1296US6939804B2Formation of composite tungsten filmsAPPLIED MATERIALS INC·Filed 2002·Granted Sep 6, 2005·116 cites·61 claims
- 1396US6911391B2Integration of titanium and titanium nitride layersAPPLIED MATERIALS INC·Filed 2002·Granted Jun 28, 2005·77 cites·24 claims
- 1496US6720027B2Cyclical deposition of a variable content titanium silicon nitride layerAPPLIED MATERIALS INC·Filed 2002·Granted Apr 13, 2004·104 cites·35 claims
- 1596US6660126B2Lid assembly for a processing system to facilitate sequential deposition techniquesAPPLIED MATERIALS INC·Filed 2001·Granted Dec 9, 2003·128 cites·28 claims
- 1695US7867914B2System and method for forming an integrated barrier layerAPPLIED MATERIALS INC·Filed 2007·Granted Jan 11, 2011·23 cites·3 claims
- 1795US7514353B2Contact metallization scheme using a barrier layer over a silicide layerAPPLIED MATERIALS INC·Filed 2006·Granted Apr 7, 2009·37 cites·33 claims
- 1895US7473638B2Plasma-enhanced cyclic layer deposition process for barrier layersAPPLIED MATERIALS INC·Filed 2006·Granted Jan 6, 2009·20 cites·36 claims
- 1995US6827978B2Deposition of tungsten filmsAPPLIED MATERIALS INC·Filed 2002·Granted Dec 7, 2004·109 cites·43 claims
- 2095US6797340B2Method for depositing refractory metal layers employing sequential deposition techniquesAPPLIED MATERIALS INC·Filed 2002·Granted Sep 28, 2004·167 cites·20 claims
- 2195US6734020B2Valve control system for atomic layer deposition chamberAPPLIED MATERIALS INC·Filed 2001·Granted May 11, 2004·135 cites·11 claims
- 2294US6809026B2Selective deposition of a barrier layer on a metal filmAPPLIED MATERIALS INC·Filed 2002·Granted Oct 26, 2004·92 cites·43 claims
- 2392US7384867B2Formation of composite tungsten filmsAPPLIED MATERIALS INC·Filed 2005·Granted Jun 10, 2008·16 cites·48 claims
- 2492US7279432B2System and method for forming an integrated barrier layerAPPLIED MATERIALS INC·Filed 2003·Granted Oct 9, 2007·50 cites·18 claims
- 2591US6939801B2Selective deposition of a barrier layer on a dielectric materialAPPLIED MATERIALS INC·Filed 2002·Granted Sep 6, 2005·56 cites·43 claims
- 2690US7396565B2Multiple precursor cyclical deposition systemAPPLIED MATERIALS INC·Filed 2004·Granted Jul 8, 2008·33 cites·15 claims
- 2789US6646235B2Multi-zone resistive heaterAPPLIED MATERIALS INC·Filed 2001·Granted Nov 11, 2003·43 cites·4 claims
- 2887US7732325B2Plasma-enhanced cyclic layer deposition process for barrier layersAPPLIED MATERIALS INC·Filed 2009·Granted Jun 8, 2010·8 cites·20 claims
- 2987US7223323B2Multi-chemistry plating systemAPPLIED MATERIALS INC·Filed 2003·Granted May 29, 2007·44 cites·1 claims
- 3087US6645884B1Method of forming a silicon nitride layer on a substrateAPPLIED MATERIALS INC·Filed 1999·Granted Nov 11, 2003·61 cites·26 claims
- 3184US7779784B2Apparatus and method for plasma assisted depositionAPPLIED MATERIALS INC·Filed 2005·Granted Aug 24, 2010·8 cites·32 claims
- 3281US6218301B1Deposition of tungsten films from W(CO)6APPLIED MATERIALS INC·Filed 2000·Granted Apr 17, 2001·23 cites·72 claims
- 3380US7781326B2Formation of a tantalum-nitride layerAPPLIED MATERIALS INC·Filed 2005·Granted Aug 24, 2010·4 cites·36 claims
- 3480US6699380B1Modular electrochemical processing systemAPPLIED MATERIALS INC·Filed 2002·Granted Mar 2, 2004·28 cites·25 claims
- 3579US7201803B2Valve control system for atomic layer deposition chamberAPPLIED MATERIALS INC·Filed 2003·Granted Apr 10, 2007·21 cites·6 claims
- 3677US7247222B2Electrochemical processing cellAPPLIED MATERIALS INC·Filed 2002·Granted Jul 24, 2007·18 cites·32 claims
- 3776US7128823B2Anolyte for copper platingAPPLIED MATERIALS INC·Filed 2003·Granted Oct 31, 2006·16 cites·31 claims
- 3873US6455421B1Plasma treatment of tantalum nitride compound films formed by chemical vapor depositionAPPLIED MATERIALS INC·Filed 2000·Granted Sep 24, 2002·13 cites·29 claims
- 3971US6530992B1Method of forming a film in a chamber and positioning a substitute in a chamberAPPLIED MATERIALS INC·Filed 1999·Granted Mar 11, 2003·40 cites·6 claims
- 4063US7504335B2Grafted seed layer for electrochemical platingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 17, 2009·2 cites·14 claims
- 4162US7473339B2Slim cell platform plumbingAPPLIED MATERIALS INC·Filed 2004·Granted Jan 6, 2009·3 cites·9 claims
- 4260US2006266655A1Multiple chemistry electrochemical plating methodSUN ZHI-WEN·Filed 2006·Application pending·0 cites
- 4355US2007151861A1Reliability barrier integration for cu applicationXI MING·Filed 2007·Application pending·0 cites
- 4452US9012334B2Formation of a tantalum-nitride layerSEUTTER SEAN M·Filed 2012·Granted Apr 21, 2015·0 cites·20 claims
- 4552US2007099415A1Integration process of tungsten atomic layer deposition for metallization applicationCHEN LING·Filed 2006·Application pending·0 cites
- 4651US2007181441A1Method and apparatus for electropolishingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4750US8114789B2Formation of a tantalum-nitride layerSEUTTER SEAN M·Filed 2010·Granted Feb 14, 2012·0 cites·20 claims
- 4850US6869516B2Method for removing electrolyte from electrical contacts and wafer touching areasAPPLIED MATERIALS INC·Filed 2002·Granted Mar 22, 2005·2 cites·19 claims
- 4950US2004154926A1Multiple chemistry electrochemical plating methodFiled 2003·Application pending·0 cites
- 5050US2009120799A1Multiple-step electrodeposition process for direct copper plating on barrier metalsSUN ZHI-WEN·Filed 2008·Application pending·0 cites
Showing the top 50 of 87 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →