Inventor · disambiguated record
Kouji Haga
Also filed as: HAGA KOUJI
12 granted patents·5 pending applications·64 citations·filing 2000–2022
89Inventor score
Top patents by PatentIndex Score
17 records- 0188US8002860B2CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasiveHITACHI CHEMICAL CO LTD·Filed 2009·Granted Aug 23, 2011·12 cites·25 claims
- 0287US7837800B2CMP polishing slurry and polishing methodHITACHI CHEMICAL CO LTD·Filed 2008·Granted Nov 23, 2010·10 cites·8 claims
- 0376US7838482B2CMP polishing compound and polishing methodHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 23, 2010·15 cites·9 claims
- 0473US8501625B2Polishing liquid for metal film and polishing methodHAGA KOUJI·Filed 2008·Granted Aug 6, 2013·4 cites·5 claims
- 0571US8168541B2CMP polishing slurry and polishing methodFUKASAWA MASATO·Filed 2010·Granted May 1, 2012·2 cites·16 claims
- 0666US7410409B1Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compoundHITACHI CHEMICAL CO LTD·Filed 2000·Granted Aug 12, 2008·9 cites·19 claims
- 0762US9293344B2Cmp polishing slurry and method of polishing substrateFUKASAWA MASATO·Filed 2005·Granted Mar 22, 2016·2 cites·16 claims
- 0862US7311855B2Polishing slurry for chemical mechanical polishing and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2003·Granted Dec 25, 2007·7 cites·6 claims
- 0960US8734204B2Polishing solution for metal films and polishing method using the sameHAGA KOUJI·Filed 2009·Granted May 27, 2014·1 cites·11 claims
- 1060US8231735B2Polishing slurry for chemical mechanical polishing and method for polishing substrateHAGA KOUJI·Filed 2007·Granted Jul 31, 2012·1 cites·5 claims
- 1158US10037894B2Polishing liquid for metal and polishing methodHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jul 31, 2018·1 cites·18 claims
- 1251US2025188315A1Polishing agent and polishing methodRESONAC CORP·Filed 2022·Application pending·0 cites
- 1350US2013217229A1Polishing liquid for metal film and polishing methodHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1449US8900335B2CMP polishing slurry and method of polishing substrateFUKASAWA MASATO·Filed 2010·Granted Dec 2, 2014·0 cites·8 claims
- 1548US2008254717A1Cmp Polishing Slurry and Method of Polishing SubstrateHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 1647US2007169421A1CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasiveKOYAMA NAOYUKI·Filed 2007·Application pending·0 cites
- 1743US2023094224A1Polishing agent, stock solution for polishing agent, and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
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