Assignee
FUKASAWA MASATO
JP·4 granted patents·1 pending application·5 citations·filing 2005–2010
Top patents by PatentIndex Score
5 records- 0171US8168541B2CMP polishing slurry and polishing methodFUKASAWA MASATO·Filed 2010·Granted May 1, 2012·2 cites·16 claims
- 0262US9293344B2Cmp polishing slurry and method of polishing substrateFUKASAWA MASATO·Filed 2005·Granted Mar 22, 2016·2 cites·16 claims
- 0359US8524111B2CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing methodFUKASAWA MASATO·Filed 2007·Granted Sep 3, 2013·1 cites·30 claims
- 0449US8900335B2CMP polishing slurry and method of polishing substrateFUKASAWA MASATO·Filed 2010·Granted Dec 2, 2014·0 cites·8 claims
- 0542US2010015806A1Cmp polishing slurry, additive liquid for cmp polishing slurry, and substrate-polishing processes using the sameFUKASAWA MASATO·Filed 2007·Application pending·0 cites
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