Assignee
KOYAMA NAOYUKI
JP·1 granted patent·1 pending application·13 citations·filing 2004–2007
Top patents by PatentIndex Score
2 records- 0165US8075800B2Polishing slurry and polishing methodKOYAMA NAOYUKI·Filed 2004·Granted Dec 13, 2011·13 cites·15 claims
- 0247US2007169421A1CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasiveKOYAMA NAOYUKI·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when KOYAMA NAOYUKI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →