Inventor · disambiguated record
Nobutoshi Saito
Also filed as: SAITO NOBUTOSHI
12 granted patents·11 pending applications·159 citations·filing 1999–2014
92Inventor score
Top patents by PatentIndex Score
23 records- 0196USRE45687EPlating apparatus and plating methodEBARA CORP·Filed 2014·Granted Sep 29, 2015·14 cites·22 claims
- 0293US8177944B2Plating apparatus and plating methodSAITO NOBUTOSHI·Filed 2008·Granted May 15, 2012·18 cites·21 claims
- 0393US7402227B2Plating apparatus and methodEBARA CORP·Filed 2004·Granted Jul 22, 2008·34 cites·30 claims
- 0490US8486234B2Plating apparatus and plating methodSAITO NOBUTOSHI·Filed 2012·Granted Jul 16, 2013·5 cites·16 claims
- 0587US8252167B2Plating apparatusKURIYAMA FUMIO·Filed 2010·Granted Aug 28, 2012·4 cites·14 claims
- 0687US8012332B2Plating apparatus and methodEBARA CORP·Filed 2008·Granted Sep 6, 2011·4 cites·6 claims
- 0787US7012333B2Lead free bump and method of forming the sameEBARA CORP·Filed 2003·Granted Mar 14, 2006·36 cites·5 claims
- 0874US7875158B2Plating apparatusEBARA CORP·Filed 2004·Granted Jan 25, 2011·7 cites·14 claims
- 0973US8317993B2Plating method and apparatusKURIYAMA FUMIO·Filed 2009·Granted Nov 27, 2012·4 cites·11 claims
- 1071US6716332B1Plating method and apparatusEBARA CORP·Filed 1999·Granted Apr 6, 2004·31 cites·19 claims
- 1168US2009301395A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2009·Application pending·0 cites
- 1267US2009218231A1Plating apparatusYAJIMA TOSHIKAZU·Filed 2009·Application pending·0 cites
- 1360US2013015075A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2012·Application pending·0 cites
- 1457US8784636B2Plating apparatus and plating methodNAGAI MIZUKI·Filed 2008·Granted Jul 22, 2014·1 cites·15 claims
- 1553US2014287580A1Method for forming conductive structure, and plating apparatus and plating methodEBARA CORP·Filed 2014·Application pending·0 cites
- 1649US2006141157A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2004·Application pending·0 cites
- 1748US2004262150A1Plating deviceFiled 2003·Application pending·0 cites
- 1846US2005279640A1Method of forming a lead-free bump and a plating apparatus thereforSHIMOYAMA MASASHI·Filed 2005·Application pending·0 cites
- 1946US2002027080A1Plating apparatus and methodFiled 2001·Application pending·0 cites
- 2045US7118664B2Plating method and apparatusEBARA CORP·Filed 2004·Granted Oct 10, 2006·1 cites·16 claims
- 2141US2007117365A1Plating method and apparatusEBARA CORP·Filed 2004·Application pending·0 cites
- 2239US2012160696A1Electroplating methodARAKI YUJI·Filed 2011·Application pending·0 cites
- 2337US2006081478A1Plating apparatus and plating methodSAHODA TSUYOSHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →