Inventor · disambiguated record
Erich Preiner
Also filed as: PREINER ERICH
5 granted patents·6 pending applications·1 citations·filing 2014–2025
63Inventor score
Top patents by PatentIndex Score
11 records- 0181US2025349688A1Component Carrier With Photoimageable Dielectric Layer and Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic RadiationAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2025·Application pending·0 cites
- 0269US12381138B2Component carrier with a photoimageable dielectric layer and a structured conductive layer being used as a mask for selectively exposing the photoimageable dielectric layer with electromagnetic radiationAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Aug 5, 2025·0 cites·15 claims
- 0365US10645816B2Method for contacting and rewiring an electronic component embedded into a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted May 5, 2020·1 cites·4 claims
- 0463US11570904B2Method for contacting and rewiring an electronic component embedded into a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jan 31, 2023·0 cites·18 claims
- 0552US11877388B2Component carrier with embedded component covered by functional film having an inhomogeneous thickness distributionAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Jan 16, 2024·0 cites·17 claims
- 0650US11683884B2Component carrier with embedded component connected in cavity by anchored first and second polymersAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Jun 20, 2023·0 cites·15 claims
- 0750US2020083154A1Component Carrier With a Photoimageable Dielectric Layer and a Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic RadiationAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Application pending·0 cites
- 0849US2025349727A1Component Carrier With Stamped Design Layer Structure and Embedded ComponentAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 0946US2025137159A1Stamping Surface Profile in Design Layer and Using Patterned Electroplating Protection Structure for Defining Electroplating Structure on Seed LayerAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Application pending·0 cites
- 1041US2025142736A1Stamping Surface Profile in Design Layer and Filling an Indentation With Metallic Base Structure and Electroplating StructureAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Application pending·0 cites
- 1139US2024381538A1Manufacturing a Component Carrier by a Nano Imprint Lithography ProcessAT&S AUSTRIA TECH & SYSTEMTECHNIK·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →