Inventor · disambiguated record
Frank Truong
Also filed as: TRUONG FRANK · TRUONG FRANK H · TRUONG FRANK HIEU
22 granted patents·2 pending applications·47 citations·filing 2000–2023
92Inventor score
Top patents by PatentIndex Score
24 records- 0190US12310715B2Catheter deflection system with deflection load limiterBIOSENSE WEBSTER ISRAEL LTD·Filed 2023·Granted May 27, 2025·1 cites·20 claims
- 0288US11233009B2Embedded multi-die interconnect bridge having a molded region with through-mold viasINTEL CORP·Filed 2020·Granted Jan 25, 2022·2 cites·15 claims
- 0388US11158444B2Magnetic material having coated ferromagnetic filler particlesINTEL CORP·Filed 2018·Granted Oct 26, 2021·6 cites·22 claims
- 0480US11744480B2Catheter deflection system with deflection load limiterBIOSENSE WEBSTER ISRAEL LTD·Filed 2020·Granted Sep 5, 2023·1 cites·20 claims
- 0573US7590973B1Systems and methods for gathering, organizing and executing test casesMICROSOFT CORP·Filed 2000·Granted Sep 15, 2009·29 cites·20 claims
- 0672US11737208B2Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2019·Granted Aug 22, 2023·1 cites·13 claims
- 0770US11688692B2Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold viasINTEL CORP·Filed 2021·Granted Jun 27, 2023·0 cites·17 claims
- 0869US10546916B2Package-integrated vertical capacitors and methods of assembling sameINTEL CORP·Filed 2018·Granted Jan 28, 2020·1 cites·9 claims
- 0969US10068776B1Raster-planarized substrate interlayers and methods of planarizing sameINTEL CORP·Filed 2017·Granted Sep 4, 2018·1 cites·22 claims
- 1069US2023345621A1Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2023·Application pending·0 cites
- 1166US11728077B2Magnetic material having coated ferromagnetic filler particlesINTEL CORP·Filed 2021·Granted Aug 15, 2023·0 cites·22 claims
- 1263US11296186B2Package-integrated vertical capacitors and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 5, 2022·0 cites·12 claims
- 1361US8747417B2Device and method for the implantation of active fixation medical leadsTRUONG FRANK·Filed 2009·Granted Jun 10, 2014·3 cites·7 claims
- 1458US11571876B2Dielectric film with pressure sensitive microcapsules of adhesion promoterINTEL CORP·Filed 2017·Granted Feb 7, 2023·0 cites·12 claims
- 1553US9744350B2Method for the implantation of active fixation medical leadsPACESETTER INC·Filed 2014·Granted Aug 29, 2017·0 cites·5 claims
- 1653US8170692B2Implant tool for active fixation leadTRUONG FRANK·Filed 2010·Granted May 1, 2012·2 cites·3 claims
- 1749US10111338B2Build-up high-aspect ratio openingINTEL CORP·Filed 2017·Granted Oct 23, 2018·0 cites·16 claims
- 1846US11574874B2Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitchINTEL CORP·Filed 2017·Granted Feb 7, 2023·0 cites·20 claims
- 1945US11855125B2Capacitors with nanoislands on conductive platesINTEL CORP·Filed 2019·Granted Dec 26, 2023·0 cites·14 claims
- 2045US11462432B2Dual side de-bonding in component carriers using photoablationINTEL CORP·Filed 2018·Granted Oct 4, 2022·0 cites·20 claims
- 2144US11276634B2High density package substrate formed with dielectric bi-layerINTEL CORP·Filed 2017·Granted Mar 15, 2022·0 cites·19 claims
- 2243US11348865B2Electronic device including a substrate having interconnectsINTEL CORP·Filed 2019·Granted May 31, 2022·0 cites·22 claims
- 2343US2023187331A1Interposer with a glass core that includes openings and through glass viasINTEL CORP·Filed 2021·Application pending·0 cites
- 2441US11728265B2Selective deposition of embedded thin-film resistors for semiconductor packagingINTEL CORP·Filed 2018·Granted Aug 15, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →