Inventor · disambiguated record
Norifumi Kawamura
Also filed as: KAWAMURA NORIFUMI
11 granted patents·8 pending applications·8 citations·filing 2004–2025
81Inventor score
Files withSHINETSU CHEMICAL CO14KIDO JUNJI2KAWAMURA NORIFUMI1MATSUMOTO TOSHIO1UNIV YAMAGATA NAT UNIV CORP1
Top patents by PatentIndex Score
19 records- 0178US12305036B2Epoxy resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Granted May 20, 2025·1 cites·15 claims
- 0275US10793712B2Heat-curable resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Oct 6, 2020·2 cites·6 claims
- 0368US2024263004A1Resin composition for encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0467US2025382494A1Motor-sealing resin compositionSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 0559US2022372274A1Resin composition for encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0658US10676635B2Silicone-modified epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2018·Granted Jun 9, 2020·0 cites·5 claims
- 0758US2020392340A1Silicone-modified epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 0856US9196850B2Organic devices, organic electroluminescent devices, organic solar cells, organic FET structures and production method of organic devicesMATSUMOTO TOSHIO·Filed 2004·Granted Nov 24, 2015·3 cites·6 claims
- 0952US11028269B2Silicone-modified epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2018·Granted Jun 8, 2021·0 cites·3 claims
- 1052US2023399467A1Resin composition for encapsulating semiconductor element-mounted surface of substrate with semiconductor element mounted thereon or semiconductor element-forming surface of wafer with semiconductor element formed thereon, and use thereofSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 1150US8558451B2Organic electroluminescent deviceKIDO JUNJI·Filed 2004·Granted Oct 15, 2013·2 cites·16 claims
- 1245US2023312909A1Thermosetting resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 1343US9203046B2Organic electroluminescent device and production process thereofKIDO JUNJI·Filed 2004·Granted Dec 1, 2015·0 cites·14 claims
- 1441US11059973B2Heat-curable resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Jul 13, 2021·0 cites·7 claims
- 1541US11046848B2Heat-curable resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Jun 29, 2021·0 cites·12 claims
- 1639US9966571B2Organic electroluminescent lighting deviceUNIV YAMAGATA NAT UNIV CORP·Filed 2015·Granted May 8, 2018·0 cites·6 claims
- 1738US8227980B2Organic EL deviceKAWAMURA NORIFUMI·Filed 2009·Granted Jul 24, 2012·0 cites·19 claims
- 1836US2021024749A1Heat-curable maleimide resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 1935US2019127580A1Semiconductor Encapsulating Resin Composition and Semiconductor DeviceSHINETSU CHEMICAL CO·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →