Silicone-modified epoxy resin composition and semiconductor device

Abstract

The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.

1 . A silicone-modified epoxy resin composition comprising:
 (P) a cyanate ester compound having at least two cyanato groups per molecule,   (A) a silicone-modified epoxy resin obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane having the average compositional formula (1):
   H a R b SiO (4-a-b)/2   (1)
 
   
       wherein R is each independently a C 1 -C 10  monovalent hydrocarbon group, a is a positive number: 0.01≤a≤1, b is a positive number: 1≤b≤3, meeting 1.01≤a+b<4, and
 (F) a phenol compound having at least two phenolic hydroxyl groups per molecule and/or a silicone-modified phenolic resin obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane having the average compositional formula (1), 
 wherein a molar ratio of epoxy groups in the epoxy resin (A) to cyanato groups in the cyanate ester compound (P) is in the range of 0.04 to 0.30, and a molar ratio of phenolic hydroxyl groups in the phenol compound (F) to cyanato groups in the cyanate ester compound (P) is in the range of 0.08 to 0.30. 
 
     
     
         2 . The silicone-modified epoxy resin composition of  claim 1  wherein component (P) is a compound having the general formula (2): 
       
         
           
           
               
               
           
         
         wherein R 1  and R 2  are each independently hydrogen or C 1 -C 4  alkyl, R 3  is each independently a divalent group selected from the following formulae: 
       
       
         
           
           
               
               
           
         
         wherein R 4  is each independently hydrogen or methyl, and n is an integer of 0 to 10. 
       
     
     
         3 . The silicone-modified epoxy resin composition of  claim 1  wherein the organopolysiloxane in components (A) and (F) is at least one member selected from compounds having the formulae (a), (b) and (c): 
       
         
           
           
               
               
           
         
         wherein R is as defined above, R 1  is hydrogen or a group as defined for R, n 1  is an integer of 0 to 200, n 2  is an integer of 0 to 2, n 3  is an integer of 0 to 10, with the proviso that n′, n 2  and n 3  are not equal to 0 at the same time, and R 2  is a group having the formula (a′): 
       
       
         
           
           
               
               
           
         
         wherein R and R 1  are as defined above, n 4  is an integer of 1 to 10, siloxane units each in brackets may be randomly bonded or form blocks, the compound of formula (a) containing at least one silicon-bonded hydrogen per molecule, 
       
       
         
           
           
               
               
           
         
         wherein R is as defined above, n 5  is an integer of 0 to 10, n 6  is an integer of 1 to 4, meeting 3≤n 5 +n 6 ≤12, the arrangement of siloxane units each in brackets is not limited, 
       
       
         
           
           
               
               
           
         
         wherein R and R 1  are as defined above, r is an integer of 0 to 3, and R 7  is hydrogen or a C 1 -C 10  organic group, the compound of formula (c) containing at least one silicon-bonded hydrogen per molecule. 
       
     
     
         4 . The silicone-modified epoxy resin composition of  claim 1  wherein the alkenyl-containing phenol compound in component (F) has the following formula 
       
         
           
           
               
               
           
         
       
     
     
         5 . A semiconductor device encapsulated with a cured product of the silicone-modified epoxy resin composition of  claim 1 .