Inventor · disambiguated record
Jaehak Yee
Also filed as: YEE JAEHAK
5 granted patents·26 citations·filing 2010–2016
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0187US9287204B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2013·Granted Mar 15, 2016·8 cites·25 claims
- 0284US9245770B2Semiconductor device and method of simultaneous molding and thermalcompression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Jan 26, 2016·7 cites·24 claims
- 0376US9240331B2Semiconductor device and method of making bumpless flipchip interconnect structuresSTATS CHIPPAC LTD·Filed 2013·Granted Jan 19, 2016·4 cites·22 claims
- 0475US9721921B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2016·Granted Aug 1, 2017·2 cites·23 claims
- 0565US9105647B2Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill materialHU JUNWEI·Filed 2010·Granted Aug 11, 2015·5 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →