Inventor · disambiguated record

Koohong Lee

Also filed as: LEE KOOHONG

4 granted patents·21 citations·filing 2013–2016

73Inventor score

Technology areasH10W

Files withSTATS CHIPPAC LTD4

Top patents by PatentIndex Score

4 records

0187US9287204B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2013·Granted Mar 15, 2016·8 cites·25 claims
0284US9245770B2Semiconductor device and method of simultaneous molding and thermalcompression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Jan 26, 2016·7 cites·24 claims
0376US9240331B2Semiconductor device and method of making bumpless flipchip interconnect structuresSTATS CHIPPAC LTD·Filed 2013·Granted Jan 19, 2016·4 cites·22 claims
0475US9721921B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2016·Granted Aug 1, 2017·2 cites·23 claims

Join the waitlist — get patent alerts

Get an alert when Koohong Lee files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →