Inventor · disambiguated record
Manickam Thavarajah
Also filed as: THAVARAJAH MANICKAM
13 granted patents·1 pending application·620 citations·filing 1997–2005
93Inventor score
Top patents by PatentIndex Score
14 records- 0194US5886398AMolded laminate package with integral mold gateLSI LOGIC CORP·Filed 1997·Granted Mar 23, 1999·184 cites·20 claims
- 0289US6872321B2Direct positive image photo-resist transfer of substrate designLSI LOGIC CORP·Filed 2002·Granted Mar 29, 2005·43 cites·20 claims
- 0389US5949137AStiffener ring and heat spreader for use with flip chip packaging assembliesLSI LOGIC CORP·Filed 1997·Granted Sep 7, 1999·156 cites·29 claims
- 0485US5998242AVacuum assisted underfill process and apparatus for semiconductor package fabricationLSI LOGIC CORP·Filed 1997·Granted Dec 7, 1999·90 cites·23 claims
- 0582US6933602B1Semiconductor package having a thermally and electrically connected heatspreaderLSI LOGIC CORP·Filed 2003·Granted Aug 23, 2005·38 cites·12 claims
- 0679US6867480B2Electromagnetic interference package protectionLSI LOGIC CORP·Filed 2003·Granted Mar 15, 2005·29 cites·20 claims
- 0771US6117695AApparatus and method for testing a flip chip integrated circuit package adhesive layerLSI LOGIC CORP·Filed 1998·Granted Sep 12, 2000·43 cites·3 claims
- 0858US5992242ASilicon wafer or die strength test fixture using high pressure fluidLSI LOGIC CORP·Filed 1998·Granted Nov 30, 1999·21 cites·1 claims
- 0955US6603201B1Electronic substrateLSI LOGIC CORP·Filed 2002·Granted Aug 5, 2003·6 cites·16 claims
- 1054US6555914B1Integrated circuit package viaLSI LOGIC CORP·Filed 2001·Granted Apr 29, 2003·7 cites·14 claims
- 1145US7436060B2Semiconductor package and process utilizing pre-formed mold cap and heatspreader assemblyLSI CORP·Filed 2004·Granted Oct 14, 2008·2 cites·14 claims
- 1240US6777803B2Solder mask on bonding ringLSI LOGIC CORP·Filed 2002·Granted Aug 17, 2004·1 cites·20 claims
- 1340US2007163109A1Strip for integrated circuit packages having a maximized usable areaTAKIAR HEM·Filed 2005·Application pending·0 cites
- 1438US6801437B2Electronic organic substrateLSI LOGIC CORP·Filed 2003·Granted Oct 5, 2004·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →