Assignee
TAKIAR HEM
US·9 granted patents·11 pending applications·17 citations·filing 2005–2012
Top patents by PatentIndex Score
20 records- 0177US8637978B2System-in-a-package based flash memory cardTAKIAR HEM·Filed 2011·Granted Jan 28, 2014·3 cites·16 claims
- 0273US8852999B2System-in-a-package based flash memory cardTAKIAR HEM·Filed 2011·Granted Oct 7, 2014·2 cites·9 claims
- 0371US8470640B2Method of fabricating stacked semiconductor package with localized cavities for wire bondingTAKIAR HEM·Filed 2008·Granted Jun 25, 2013·5 cites·15 claims
- 0469US8129272B2Hidden plating tracesTAKIAR HEM·Filed 2009·Granted Mar 6, 2012·3 cites·16 claims
- 0562US8432043B2Stacked wire bonded semiconductor package with low profile bond lineTAKIAR HEM·Filed 2008·Granted Apr 30, 2013·2 cites·18 claims
- 0662US8294251B2Stacked semiconductor package with localized cavities for wire bondingTAKIAR HEM·Filed 2008·Granted Oct 23, 2012·2 cites·20 claims
- 0752US9209159B2Hidden plating tracesTAKIAR HEM·Filed 2012·Granted Dec 8, 2015·0 cites·17 claims
- 0850US2008131999A1Method of die stacking using insulated wire bondsTAKIAR HEM·Filed 2007·Application pending·0 cites
- 0950US2008128880A1Die stacking using insulated wire bondsTAKIAR HEM·Filed 2007·Application pending·0 cites
- 1048US2008131998A1Method of fabricating a film-on-wire bond semiconductor deviceTAKIAR HEM·Filed 2006·Application pending·0 cites
- 1147US8241953B2Method of fabricating stacked wire bonded semiconductor package with low profile bond lineTAKIAR HEM·Filed 2008·Granted Aug 14, 2012·0 cites·18 claims
- 1243US2008237887A1Semiconductor die stack having heightened contact for wire bondTAKIAR HEM·Filed 2007·Application pending·0 cites
- 1343US2008242076A1Method of making semiconductor die stack having heightened contact for wire bondTAKIAR HEM·Filed 2007·Application pending·0 cites
- 1442US8461675B2Substrate panel with plating bar structured to allow minimum kerf widthTAKIAR HEM·Filed 2005·Granted Jun 11, 2013·0 cites·18 claims
- 1542US2008128879A1Film-on-wire bond semiconductor deviceTAKIAR HEM·Filed 2007·Application pending·0 cites
- 1641US2009166820A1Tsop leadframe strip of multiply encapsulated packagesTAKIAR HEM·Filed 2007·Application pending·0 cites
- 1740US2007004094A1Method of reducing warpage in an over-molded IC packageTAKIAR HEM·Filed 2005·Application pending·0 cites
- 1840US2007001285A1Apparatus having reduced warpage in an over-molded IC packageTAKIAR HEM·Filed 2005·Application pending·0 cites
- 1940US2007163109A1Strip for integrated circuit packages having a maximized usable areaTAKIAR HEM·Filed 2005·Application pending·0 cites
- 2037US2007207568A1SiP module with a single sided lidTAKIAR HEM·Filed 2006·Application pending·0 cites
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