Inventor · disambiguated record
Keith E. Ypma
Also filed as: YPMA KEITH · YPMA KEITH E · YPMA KEITH EDWARD
10 granted patents·4 pending applications·58 citations·filing 2014–2024
87Inventor score
Top patents by PatentIndex Score
14 records- 0195US9748128B1Systems and methods for wafer alignmentMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 29, 2017·29 cites·20 claims
- 0288US10062595B2Systems and methods for wafer alignmentMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 28, 2018·4 cites·19 claims
- 0388US9299663B2Semiconductor devices and methods for backside photo alignmentMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 29, 2016·10 cites·17 claims
- 0487US9754895B1Methods of forming semiconductor devices including determining misregistration between semiconductor levels and related apparatusesMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 5, 2017·8 cites·25 claims
- 0586US10242901B2Systems and methods for wafer alignmentMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 26, 2019·3 cites·18 claims
- 0683US10347519B2Systems and methods for wafer alignmentMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 9, 2019·2 cites·18 claims
- 0776US9741612B2Semiconductor devices and methods for backside photo alignmentMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 22, 2017·2 cites·13 claims
- 0876US2025092559A1Electrochemical deposition systems with enhanced crystallization prevention featuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0975US2025051951A1Plating and deplating currents for material co-planarity in semiconductor plating processesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1067US12146235B2Plating and deplating currents for material co-planarity in semiconductor plating processesAPPLIED MATERIALS INC·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 1167US2025116028A1Electroplating chamber using jet array to enable high mass-transferAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1266US12195867B2Electrochemical deposition systems with enhanced crystallization prevention featuresAPPLIED MATERIALS INC·Filed 2021·Granted Jan 14, 2025·0 cites·7 claims
- 1364US10600667B2Systems and methods for wafer alignmentMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 24, 2020·0 cites·22 claims
- 1436US2020306931A1Methods and apparatus for removing abrasive particlesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Keith E. Ypma files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →