Inventor · disambiguated record
Craig Mitchell
Also filed as: MITCHELL CRAIG · MITCHELL CRAIG S · MITCHELL CRAIG STEVEN
112 granted patents·14 pending applications·4,622 citations·filing 1993–2024
99Inventor score
Top patents by PatentIndex Score
126 records- 0199US5659952AMethod of fabricating compliant interface for semiconductor chipTESSERA INC·Filed 1994·Granted Aug 26, 1997·491 cites·48 claims
- 0298US9153562B2Stacked packaging improvementsTESSERA INC·Filed 2014·Granted Oct 6, 2015·60 cites·17 claims
- 0398US8927337B2Stacked packaging improvementsTESSERA INC·Filed 2013·Granted Jan 6, 2015·76 cites·18 claims
- 0498US8916781B2Cavities containing multi-wiring structures and devicesHABA BELGACEM·Filed 2011·Granted Dec 23, 2014·43 cites·36 claims
- 0598US8847376B2Microelectronic elements with post-assembly planarizationOGANESIAN VAGE·Filed 2010·Granted Sep 30, 2014·49 cites·28 claims
- 0698US8791575B2Microelectronic elements having metallic pads overlying viasOGANESIAN VAGE·Filed 2010·Granted Jul 29, 2014·87 cites·29 claims
- 0798US8598695B2Active chip on carrier or laminated chip having microelectronic element embedded thereinOGANESIAN VAGE·Filed 2010·Granted Dec 3, 2013·39 cites·29 claims
- 0898US8525314B2Stacked packaging improvementsHABA BELGACEM·Filed 2005·Granted Sep 3, 2013·98 cites·6 claims
- 0997US9349669B2Reduced stress TSV and interposer structuresINVENSAS CORP·Filed 2015·Granted May 24, 2016·23 cites·25 claims
- 1097US9000600B2Reduced stress TSV and interposer structuresINVENSAS CORP·Filed 2014·Granted Apr 7, 2015·28 cites·15 claims
- 1197US8796135B2Microelectronic elements with rear contacts connected with via first or via middle structuresOGANESIAN VAGE·Filed 2010·Granted Aug 5, 2014·45 cites·24 claims
- 1297US6977440B2Stacked packagesTESSERA INC·Filed 2003·Granted Dec 20, 2005·168 cites·33 claims
- 1397US6046076AVacuum dispense method for dispensing an encapsulant and machine thereforTESSERA INC·Filed 1997·Granted Apr 4, 2000·143 cites·25 claims
- 1496US8071424B2Substrate for a microelectronic package and method of fabricating thereofHABA BELGACEM·Filed 2010·Granted Dec 6, 2011·49 cites·38 claims
- 1596US7759782B2Substrate for a microelectronic package and method of fabricating thereofTESSERA INC·Filed 2006·Granted Jul 20, 2010·47 cites·35 claims
- 1696US6359335B1Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structuresTESSERA INC·Filed 2000·Granted Mar 19, 2002·113 cites·10 claims
- 1796US5929517ACompliant integrated circuit package and method of fabricating the sameTESSERA INC·Filed 1994·Granted Jul 27, 1999·185 cites·16 claims
- 1895US8736066B2Stacked microelectronic assemby with TSVS formed in stages and carrier above chipOGANESIAN VAGE·Filed 2011·Granted May 27, 2014·17 cites·24 claims
- 1995US6525429B1Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2000·Granted Feb 25, 2003·69 cites·20 claims
- 2095US6126428AVacuum dispense apparatus for dispensing an encapsulantTESSERA INC·Filed 1999·Granted Oct 3, 2000·99 cites·9 claims
- 2195US5766987AMicroelectronic encapsulation methods and equipmentTESSERA INC·Filed 1995·Granted Jun 16, 1998·187 cites·26 claims
- 2294US8610259B2Multi-function and shielded 3D interconnectsOGANESIAN VAGE·Filed 2010·Granted Dec 17, 2013·15 cites·36 claims
- 2394US7368695B2Image sensor package and fabrication methodTESSERA INC·Filed 2005·Granted May 6, 2008·50 cites·21 claims
- 2494US7335995B2Microelectronic assembly having array including passive elements and interconnectsTESSERA INC·Filed 2005·Granted Feb 26, 2008·35 cites·17 claims
- 2594US6897565B2Stacked packagesTESSERA INC·Filed 2002·Granted May 24, 2005·101 cites·31 claims
- 2694US6329224B1Encapsulation of microelectronic assembliesTESSERA INC·Filed 1998·Granted Dec 11, 2001·160 cites·38 claims
- 2794US5776796AMethod of encapsulating a semiconductor packageTESSERA INC·Filed 1996·Granted Jul 7, 1998·173 cites·47 claims
- 2894US5548091ASemiconductor chip connection components with adhesives and methods for bonding to the chipTESSERA INC·Filed 1993·Granted Aug 20, 1996·151 cites·16 claims
- 2993US8486758B2Simultaneous wafer bonding and interconnect joiningOGANESIAN VAGE·Filed 2011·Granted Jul 16, 2013·14 cites·48 claims
- 3093US6458628B1Methods of encapsulating a semiconductor chip using a settable encapsulantTESSERA INC·Filed 2000·Granted Oct 1, 2002·59 cites·8 claims
- 3193US5663106AMethod of encapsulating die and chip carrierTESSERA INC·Filed 1994·Granted Sep 2, 1997·173 cites·47 claims
- 3292US7224056B2Back-face and edge interconnects for lidded packageTESSERA INC·Filed 2004·Granted May 29, 2007·53 cites·24 claims
- 3392US6885106B1Stacked microelectronic assemblies and methods of making sameTESSERA INC·Filed 2002·Granted Apr 26, 2005·78 cites·60 claims
- 3492US6870272B2Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2002·Granted Mar 22, 2005·55 cites·21 claims
- 3592US6603209B1Compliant integrated circuit packageTESSERA INC·Filed 1999·Granted Aug 5, 2003·96 cites·25 claims
- 3692US6602740B1Encapsulation of microelectronic assembliesTESSERA INC·Filed 2000·Granted Aug 5, 2003·71 cites·37 claims
- 3792US6232152B1Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structuresTESSERA INC·Filed 1998·Granted May 15, 2001·131 cites·20 claims
- 3891US8847380B2Staged via formation from both sides of chipOGANESIAN VAGE·Filed 2010·Granted Sep 30, 2014·10 cites·25 claims
- 3991US8637968B2Stacked microelectronic assembly having interposer connecting active chipsHABA BELGACEM·Filed 2010·Granted Jan 28, 2014·14 cites·33 claims
- 4091US7368818B2Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2005·Granted May 6, 2008·18 cites·15 claims
- 4191US6169328B1Semiconductor chip assemblyTESSERA INC·Filed 1999·Granted Jan 2, 2001·150 cites·44 claims
- 4290US6255738B1Encapsulant for microelectronic devicesTESSERA INC·Filed 1997·Granted Jul 3, 2001·127 cites·70 claims
- 4389US7534652B2Microelectronic elements with compliant terminal mountings and methods for making the sameTESSERA INC·Filed 2005·Granted May 19, 2009·19 cites·19 claims
- 4489US6723584B2Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2002·Granted Apr 20, 2004·39 cites·20 claims
- 4589US6521480B1Method for making a semiconductor chip packageTESSERA INC·Filed 2000·Granted Feb 18, 2003·64 cites·46 claims
- 4687US9355948B2Multi-function and shielded 3D interconnectsTESSERA INC·Filed 2014·Granted May 31, 2016·6 cites·18 claims
- 4787US9269692B2Stacked microelectronic assembly with TSVS formed in stages and carrier above chipTESSERA INC·Filed 2014·Granted Feb 23, 2016·5 cites·22 claims
- 4887US8709913B2Simultaneous wafer bonding and interconnect joiningTESSERA INC·Filed 2013·Granted Apr 29, 2014·7 cites·20 claims
- 4987US6541874B2Encapsulation of microelectronic assembliesTESSERA INC·Filed 2001·Granted Apr 1, 2003·41 cites·20 claims
- 5087US6218215B1Methods of encapsulating a semiconductor chip using a settable encapsulantTESSERA INC·Filed 2000·Granted Apr 17, 2001·35 cites·14 claims
Showing the top 50 of 126 patent records by PatentIndex Score.
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