Inventor · disambiguated record
Mark Kawaguchi
Also filed as: KAWAGUCHI MARK · KAWAGUCHI MARK N · KAWAGUCHI MARK NAOSHI
28 granted patents·22 pending applications·784 citations·filing 2000–2024
96Inventor score
Files withLAM RES CORP25APPLIED MATERIALS INC14KAWAGUCHI MARK NAOSHI3KHOLODENKO ARNOLD2VALCORE JOHN2
Top patents by PatentIndex Score
50 records- 0197US6692903B2Substrate cleaning apparatus and methodAPPLIED MATERIALS INC·Filed 2000·Granted Feb 17, 2004·414 cites·49 claims
- 0296US7604708B2Cleaning of native oxide with hydrogen-containing radicalsAPPLIED MATERIALS INC·Filed 2004·Granted Oct 20, 2009·226 cites·16 claims
- 0389US11011388B2Plasma apparatus for high aspect ratio selective lateral etch using cyclic passivation and etchingLAM RES CORP·Filed 2019·Granted May 18, 2021·7 cites·18 claims
- 0488US6680164B2Solvent free photoresist strip and residue removal processing for post etching of low-k filmsAPPLIED MATERIALS INC·Filed 2001·Granted Jan 20, 2004·42 cites·44 claims
- 0586US8317934B2Multi-stage substrate cleaning method and apparatusKHOLODENKO ARNOLD·Filed 2009·Granted Nov 27, 2012·10 cites·14 claims
- 0685US11488831B2Efficient cleaning and etching of high aspect ratio structuresLAM RES CORP·Filed 2019·Granted Nov 1, 2022·3 cites·16 claims
- 0784US8757177B2Multi-stage substrate cleaning method and apparatusKHOLODENKO ARNOLD·Filed 2012·Granted Jun 24, 2014·6 cites·17 claims
- 0884US7655571B2Integrated method and apparatus for efficient removal of halogen residues from etched substratesAPPLIED MATERIALS INC·Filed 2006·Granted Feb 2, 2010·11 cites·26 claims
- 0984US6991739B2Method of photoresist removal in the presence of a dielectric layer having a low k-valueAPPLIED MATERIALS INC·Filed 2001·Granted Jan 31, 2006·34 cites·26 claims
- 1083US9735002B2Integrated apparatus for efficient removal of halogen residues from etched substratesKAWAGUCHI MARK NAOSHI·Filed 2008·Granted Aug 15, 2017·12 cites·16 claims
- 1182US11062897B2Metal doped carbon based hard mask removal in semiconductor fabricationLAM RES CORP·Filed 2017·Granted Jul 13, 2021·4 cites·26 claims
- 1281US12347650B2Substrate processing system including dual ion filter for downstream plasmaLAM RES CORP·Filed 2024·Granted Jul 1, 2025·0 cites·17 claims
- 1381US11469079B2Ultrahigh selective nitride etch to form FinFET devicesLAM RES CORP·Filed 2017·Granted Oct 11, 2022·3 cites·13 claims
- 1477US12040193B2Efficient cleaning and etching of high aspect ratio structuresLAM RES CORP·Filed 2022·Granted Jul 16, 2024·0 cites·16 claims
- 1576US2024363355A1Efficient cleaning and etching of high aspect ratio structuresLAM RES CORP·Filed 2024·Application pending·0 cites
- 1671US9159593B2Method of particle contaminant removalKAWAGUCHI MARK NAOSHI·Filed 2009·Granted Oct 13, 2015·4 cites·18 claims
- 1771US2024387258A1Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2024·Application pending·0 cites
- 1869US10276398B2High aspect ratio selective lateral etch using cyclic passivation and etchingLAM RES CORP·Filed 2017·Granted Apr 30, 2019·1 cites·21 claims
- 1966US2023084901A1Ultrahigh selective nitride etch to form finfet devicesLAM RES CORP·Filed 2022·Application pending·0 cites
- 2064US11967486B2Substrate processing system including dual ion filter for downstream plasmaLAM RES CORP·Filed 2020·Granted Apr 23, 2024·0 cites·15 claims
- 2163US8101025B2Method for controlling corrosion of a substrateLIM EU JIN·Filed 2006·Granted Jan 24, 2012·2 cites·30 claims
- 2257US8293023B2System and method for monitoring wafer stressVALCORE JOHN·Filed 2009·Granted Oct 23, 2012·1 cites·2 claims
- 2356US7374696B2Method and apparatus for removing a halogen-containing residueAPPLIED MATERIALS INC·Filed 2004·Granted May 20, 2008·4 cites·31 claims
- 2455US7849554B2Apparatus and system for cleaning substrateLAM RES CORP·Filed 2009·Granted Dec 14, 2010·0 cites·23 claims
- 2555US2025218819A1Radiative heat windows and wafer support pads in vapor etch reactorsLAM RES CORP·Filed 2023·Application pending·0 cites
- 2655US2025308918A1Selective oxide etch using liquid precursorLAM RES CORP·Filed 2023·Application pending·0 cites
- 2755US2025216268A1Dual sensor wafer temperature measurement systemLAM RES CORP·Filed 2023·Application pending·0 cites
- 2854US12080592B2Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2019·Granted Sep 3, 2024·0 cites·8 claims
- 2954US7846347B2Method for removing a halogen-containing residueAPPLIED MATERIALS INC·Filed 2007·Granted Dec 7, 2010·0 cites·20 claims
- 3053US2025273441A1Liquid-cooled optical window for semiconductor processing chamberLAM RES CORP·Filed 2023·Application pending·0 cites
- 3151US7648916B2Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removalAPPLIED MATERIALS INC·Filed 2006·Granted Jan 19, 2010·0 cites·21 claims
- 3250US12467147B2Vapor cleaning of substrate surfacesLAM RES CORP·Filed 2020·Granted Nov 11, 2025·0 cites·12 claims
- 3349US2023298859A1Optimizing edge radical flux in a downstream plasma chamberLAM RES CORP·Filed 2021·Application pending·0 cites
- 3448US11065654B2In situ vapor deposition polymerization to form polymers as precursors to viscoelastic fluids for particle removal from substratesLAM RES CORP·Filed 2018·Granted Jul 20, 2021·0 cites·24 claims
- 3547US2025183051A1Selective precision etching of semiconductor materialsLAM RES CORP·Filed 2023·Application pending·0 cites
- 3646US2010258142A1Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrateKAWAGUCHI MARK NAOSHI·Filed 2009·Application pending·0 cites
- 3746US2025226233A1In situ declogging in plasma etchingLAM RES CORP·Filed 2021·Application pending·0 cites
- 3846US2023131233A1Rapid and precise temperature control for thermal etchingLAM RES CORP·Filed 2021·Application pending·0 cites
- 3945US2023207328A1Selective precision etching of semiconductor materialsLAM RES CORP·Filed 2021·Application pending·0 cites
- 4043US2009032880A1Method and apparatus for tunable isotropic recess etching of silicon materialsAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4140US8900374B2Method for substrate cleaning including movement of substrate below substrate cleaning moduleLIN CHENG-YU SEAN·Filed 2010·Granted Dec 2, 2014·0 cites·16 claims
- 4240US8828145B2Method of particle contaminant removalSABBA YIZHAK·Filed 2009·Granted Sep 9, 2014·0 cites·10 claims
- 4340US2007284668A1CMOS S/D SiGe DEVICE MADE WITH ALTERNATIVE INTEGRATION PROCESSAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4440US2007287244A1ALTERNATIVE INTEGRATION SCHEME FOR CMOS S/D SiGe PROCESSAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4540US2006032833A1Encapsulation of post-etch halogenic residueAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 4639US2005158667A1Solvent free photoresist strip and residue removal processing for post etching of low-k filmsAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 4737US2004195208A1Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removalFiled 2004·Application pending·0 cites
- 4836US2014083463A1System and method for monitoring wafer stressVALCORE JOHN·Filed 2012·Application pending·0 cites
- 4936US2019051540A1Systems and methods for plasma-less de-halogenationLAM RES CORP·Filed 2017·Application pending·0 cites
- 5035US2007051471A1Methods and apparatus for strippingAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →