Inventor · disambiguated record
Rajasekaran Swaminathan
Also filed as: SWAMINATHAN RAJASEKARAN · SWAMINATHAN RAJASEKARAN RAJA
45 granted patents·12 pending applications·256 citations·filing 2008–2025
98Inventor score
Files withINTEL CORP36ADVANCED MICRO DEVICES INC5SWAMINATHAN RAJASEKARAN5ALEKSOV ALEKSANDAR2APPLE INC2
Top patents by PatentIndex Score
57 records- 0198US9118151B2Interconnect cable with edge finger connectorINTEL CORP·Filed 2013·Granted Aug 25, 2015·64 cites·18 claims
- 0297US11270942B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2020·Granted Mar 8, 2022·4 cites·17 claims
- 0396US12051647B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2023·Granted Jul 30, 2024·2 cites·17 claims
- 0496US11705398B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2022·Granted Jul 18, 2023·3 cites·17 claims
- 0595US8313958B2Magnetic microelectronic device attachmentSWAMINATHAN RAJASEKARAN·Filed 2010·Granted Nov 20, 2012·28 cites·23 claims
- 0694US8609532B2Magnetically sintered conductive viaSWAMINATHAN RAJASEKARAN·Filed 2010·Granted Dec 17, 2013·22 cites·21 claims
- 0794US2025391754A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 0893US11398692B2Socket with integrated flex connectorAPPLE INC·Filed 2020·Granted Jul 26, 2022·3 cites·16 claims
- 0991US11430724B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2017·Granted Aug 30, 2022·5 cites·24 claims
- 1091US9265170B2Integrated circuit connectorsINTEL CORP·Filed 2013·Granted Feb 16, 2016·13 cites·10 claims
- 1191US8513792B2Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2009·Granted Aug 20, 2013·20 cites·18 claims
- 1290US10187996B2Printed circuit board with a recess to accommodate discrete components in a packageINTEL CORP·Filed 2017·Granted Jan 22, 2019·6 cites·19 claims
- 1388US11532563B2Package integration using fanout cavity substrateAPPLE INC·Filed 2020·Granted Dec 20, 2022·2 cites·16 claims
- 1487US12388019B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1587US10074920B2Interconnect cable with edge finger connectorINTEL CORP·Filed 2015·Granted Sep 11, 2018·7 cites·21 claims
- 1687US9832876B2CPU package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2014·Granted Nov 28, 2017·7 cites·36 claims
- 1787US7902060B2Attachment using magnetic particle based solder compositesINTEL CORP·Filed 2008·Granted Mar 8, 2011·13 cites·17 claims
- 1884US12476174B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1983US11817364B2BGA STIM package architecture for high performance systemsINTEL CORP·Filed 2018·Granted Nov 14, 2023·3 cites·15 claims
- 2083US10643945B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2017·Granted May 5, 2020·2 cites·20 claims
- 2183US8550327B2Clad solder thermal interface materialDEPPISCH CARL L·Filed 2011·Granted Oct 8, 2013·7 cites·14 claims
- 2282US9010618B2Magnetic attachment structureINTEL CORP·Filed 2013·Granted Apr 21, 2015·5 cites·6 claims
- 2379US12406914B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 2478US10784204B2Rlink—die to die channel interconnect configurations to improve signalingINTEL CORP·Filed 2016·Granted Sep 22, 2020·3 cites·22 claims
- 2577US8434668B2Magnetic attachment structureALEKSOV ALEKSANDAR·Filed 2010·Granted May 7, 2013·4 cites·16 claims
- 2676US2022344247A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2775US9461014B2Methods of forming ultra thin package structures including low temperature solder and structures formed therbyINTEL CORP·Filed 2015·Granted Oct 4, 2016·2 cites·26 claims
- 2875US8939347B2Magnetic intermetallic compound interconnectSWAMINATHAN RAJASEKARAN·Filed 2010·Granted Jan 27, 2015·4 cites·14 claims
- 2975US7906376B2Magnetic particle-based composite materials for semiconductor packagesINTEL CORP·Filed 2008·Granted Mar 15, 2011·5 cites·20 claims
- 3075US2025029900A1Glass core package substratesADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 3174US9615483B2Techniques and configurations associated with a package load assemblyINTEL CORP·Filed 2014·Granted Apr 4, 2017·3 cites·21 claims
- 3274US9603247B2Electronic package with narrow-factor via including finish layerINTEL CORP·Filed 2014·Granted Mar 21, 2017·3 cites·18 claims
- 3373US8287996B2Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic dieXU DINGYING·Filed 2009·Granted Oct 16, 2012·5 cites·11 claims
- 3471US2024030086A1Bga stim package architecture for high performance systemsINTEL CORP·Filed 2023·Application pending·0 cites
- 3569US12080632B2Glass core package substratesADVANCED MICRO DEVICES INC·Filed 2021·Granted Sep 3, 2024·0 cites·13 claims
- 3669US9472519B2Forming sacrificial composite materials for package-on-package architectures and structures formed therebyINTEL CORP·Filed 2015·Granted Oct 18, 2016·1 cites·21 claims
- 3767US9006887B2Forming sacrificial composite materials for package-on-package architectures and structures formed therebySWAMINATHAN RAJASEKARAN·Filed 2009·Granted Apr 14, 2015·2 cites·5 claims
- 3863US9064971B2Methods of forming ultra thin package structures including low temperature solder and structures formed therbyINTEL CORP·Filed 2012·Granted Jun 23, 2015·1 cites·16 claims
- 3960US9674954B2Chip package connector assemblyINTEL CORP·Filed 2013·Granted Jun 6, 2017·3 cites·17 claims
- 4060US8377550B2Flip chip package containing novel underfill materialsINTEL CORP·Filed 2009·Granted Feb 19, 2013·2 cites·20 claims
- 4157US9793233B2Forming sacrificial composite materials for package-on-package architectures and structures formed therebyINTEL CORP·Filed 2016·Granted Oct 17, 2017·0 cites·19 claims
- 4254US9478881B2Snap connector for socket assembly and associated techniques and configurationsINTEL CORP·Filed 2015·Granted Oct 25, 2016·1 cites·21 claims
- 4354US2024006290A1Lth and svlc hybrid core architecture for lower cost component embedding in package substrateADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 4453US2011147438A1Clad solder thermal interface materialDEPPISCH CARL LUDWIG·Filed 2009·Application pending·0 cites
- 4552US2025329656A1Apparatus, system, and method for integrating passive elements into electronic bridge componentsADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 4651US9847308B2Magnetic intermetallic compound interconnectINTEL CORP·Filed 2014·Granted Dec 19, 2017·0 cites·10 claims
- 4751US8569108B2Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic dieXU DINGYING·Filed 2012·Granted Oct 29, 2013·0 cites·7 claims
- 4850US8915747B2Connector assembly with integrated pitch translationINTEL CORP·Filed 2013·Granted Dec 23, 2014·1 cites·19 claims
- 4950US2013292838A1Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2013·Application pending·0 cites
- 5050US2024038596A1Double side transistors on same silicon waferADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →