Inventor · disambiguated record
Elizabeth Nofen
Also filed as: NOFEN ELIZABETH · NOFEN ELIZABETH M
9 granted patents·10 pending applications·2 citations·filing 2012–2025
78Inventor score
Top patents by PatentIndex Score
19 records- 0188US2025329604A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2025·Application pending·0 cites
- 0284US12417958B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zoneINTEL CORP·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 0383US12347743B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0481US2024014097A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Application pending·0 cites
- 0577US12258439B2Mechanophore-grafted polymers to form stress-responsive thermoset networkDAI LENORE·Filed 2023·Granted Mar 25, 2025·0 cites·2 claims
- 0671US8790670B2Detergent compositions dispersed in personal care products comprising a sorbent carrierDIAL CORP·Filed 2012·Granted Jul 29, 2014·2 cites·17 claims
- 0768US11753498B2Mechanophore-grafted polymers to form stress-responsive thermoset networkDAI LENORE·Filed 2021·Granted Sep 12, 2023·0 cites·7 claims
- 0865US12315777B2Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zoneINTEL CORP·Filed 2019·Granted May 27, 2025·0 cites·23 claims
- 0958US2025279384A1Methods and apparatus using polymer material to fill gaps between semiconductor diesINTEL CORP·Filed 2024·Application pending·0 cites
- 1053US11676876B2Semiconductor die package with warpage management and process for forming suchINTEL CORP·Filed 2019·Granted Jun 13, 2023·0 cites·26 claims
- 1153US11034791B2Mechanophore-grafted polymers to form stress-responsive thermoset networkDAI LENORE·Filed 2017·Granted Jun 15, 2021·0 cites·11 claims
- 1253US2024213164A1Tsv-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (tc-ncf) processINTEL CORP·Filed 2022·Application pending·0 cites
- 1348US2024327679A1Media tray with switchable adhesionINTEL CORP·Filed 2023·Application pending·0 cites
- 1448US2019099776A1Compressible media applicator, application system and methods for sameHACKENBERG KEN P·Filed 2017·Application pending·0 cites
- 1544US11562940B2Integrated heat spreader comprising a silver and sintering silver layered structureINTEL CORP·Filed 2019·Granted Jan 24, 2023·0 cites·23 claims
- 1643US2021242102A1Underfill material for integrated circuit (ic) packageINTEL CORP·Filed 2020·Application pending·0 cites
- 1737US2019099777A1Compressible media applicator, application system and methods for sameINTEL CORP·Filed 2017·Application pending·0 cites
- 1835US2019393112A1Encapsulant material containing fluorophores for in-situ visualization of stress in an organic packageNOFEN ELIZABETH·Filed 2018·Application pending·0 cites
- 1935US2018286704A1Processes and methods for applying underfill to singulated dieINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →