Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone

Abstract

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first package, wherein the first package comprises, a first package substrate, a first die over the first package substrate, a first mold layer over the first package substrate and around the first die, and a plurality of through mold interconnects (TMIs) through the first mold layer. The electronic package may further comprise a second package electrically coupled the first package by the TMIs, wherein the second package comprises a second package substrate, a second die over the second package substrate, and a solder resist over a surface of the second package substrate opposite from the second die. In an embodiment, the electronic package may also comprise a barrier between the first package and the second package.

What is claimed is: 
     
         1 . An electronic package, comprising:
 a first die coupled to a package substrate, the first die having a top surface;   a second die coupled to the top surface of the first die, the second die having a top surface;   a mold layer on the package substrate, the mold layer laterally spaced apart from the first die and the second die, and the mold layer having a top surface co-planar with the top surface of the second die; and   a barrier above the second die and the mold layer, at least a portion of the barrier vertically over the mold layer, wherein the barrier comprises a continuous ring in a plan view perspective.   
     
     
         2 . The electronic package of  claim 1 , further comprising:
 a thermal interface material within the continuous ring of the barrier.   
     
     
         3 . The electronic package of  claim 1 , further comprising:
 a second barrier within the continuous ring of the barrier.   
     
     
         4 . The electronic package of  claim 3 , further comprising:
 a thermal interface material within the second barrier.   
     
     
         5 . The electronic package of  claim 1 , wherein the barrier is not in contact with the second die. 
     
     
         6 . The electronic package of  claim 1 , wherein the barrier is dome shaped. 
     
     
         7 . The electronic package of  claim 1 , wherein the barrier comprises a polymeric material. 
     
     
         8 . The electronic package of  claim 7 , wherein the polymeric material comprises an acrylic polymer. 
     
     
         9 . The electronic package of  claim 7 , wherein the polymeric material comprises TiO 2  particles. 
     
     
         10 . An electronic package, comprising:
 a first die coupled to a package substrate, the first die having a top surface;   a second die coupled to the top surface of the first die, the second die having a top surface with a perimeter;   a mold layer on the package substrate, the mold layer laterally spaced apart from the first die and the second die, and the mold layer having a top surface co-planar with the top surface of the second die; and   a barrier above the second die and the mold layer, at least a portion of the barrier vertically over the mold layer, wherein the barrier comprises a continuous ring around the perimeter of the top surface of the second die.   
     
     
         11 . The electronic package of  claim 10 , further comprising:
 a thermal interface material within the continuous ring of the barrier.   
     
     
         12 . The electronic package of  claim 10 , further comprising:
 a second barrier within the continuous ring of the barrier.   
     
     
         13 . The electronic package of  claim 12 , further comprising:
 a thermal interface material within the second barrier.   
     
     
         14 . The electronic package of  claim 10 , wherein the barrier is not in contact with the second die. 
     
     
         15 . The electronic package of  claim 10 , wherein the barrier is dome shaped. 
     
     
         16 . The electronic package of  claim 10 , wherein the barrier comprises a polymeric material. 
     
     
         17 . The electronic package of  claim 16 , wherein the polymeric material comprises an acrylic polymer. 
     
     
         18 . The electronic package of  claim 16 , wherein the polymeric material comprises TiO 2  particles. 
     
     
         19 . A system comprising:
 a first electronic package, comprising:
 a first die coupled to a package substrate, the first die having a top surface; 
 a second die coupled to the top surface of the first die, the second die having a top surface; 
 a mold layer on the package substrate, the mold layer laterally spaced apart from the first die and the second die, and the mold layer having a top surface co-planar with the top surface of the second die; and 
 a conductive post in the mold layer, the conductive post laterally spaced apart from the first die and the second die; and 
   a second electronic package coupled to the first electronic package by the conductive post, wherein the second electronic package comprises a third die, the third die vertically over the second die of the first electronic package; and   a barrier between the first electronic package and the second electronic package, wherein at least a portion of the barrier is vertically over the mold layer of the first electronic package, and wherein the barrier comprises a continuous ring in a plan view perspective.   
     
     
         20 . The system of  claim 19 , further comprising:
 a thermal interface material within the continuous ring of the barrier.   
     
     
         21 . The system of  claim 19 , further comprising:
 a second barrier within the continuous ring of the barrier.   
     
     
         22 . The system of  claim 21 , further comprising:
 a thermal interface material within the second barrier.   
     
     
         23 . The system of  claim 19 , wherein the barrier is dome shaped.