Inventor · disambiguated record
Gongbai Cao
Also filed as: CAO GONGBAI
4 granted patents·5 pending applications·4 citations·filing 2010–2023
62Inventor score
Top patents by PatentIndex Score
9 records- 0185US12046520B2Method for detecting temperature of thermal chamberZING SEMICONDUCTOR CORP·Filed 2023·Granted Jul 23, 2024·1 cites·7 claims
- 0284US11923254B2Method for detecting temperature of thermal chamberZING SEMICONDUCTOR CORP·Filed 2021·Granted Mar 5, 2024·2 cites·7 claims
- 0351US9299556B2Method for preparing semiconductor substrate with insulating buried layer gettering processWEI XING·Filed 2010·Granted Mar 29, 2016·1 cites·3 claims
- 0450US2024191393A1Epitaxy susceptor, epitaxy growth apparatus and manufacturing method of semiconductor deviceZING SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 0546US2023326809A1Standard wafers, method of making the same and calibration methodZING SEMICONDUCTOR CORP·Filed 2022·Application pending·0 cites
- 0642US11562917B2Wafer positioning method and a semiconductor manufacturing apparatusZING SEMICONDUCTOR CORP·Filed 2020·Granted Jan 24, 2023·0 cites·8 claims
- 0738US2022028732A1Process for preparing epitaxy wafer and epitaxy wafer therefromZING SEMICONDUCTOR CORP·Filed 2020·Application pending·0 cites
- 0838US2021043442A1Method for improving flatness of semiconductor thin filmZING SEMICONDUCTOR CORP·Filed 2020·Application pending·0 cites
- 0938US2020347513A1Epitaxial wafer processing methodZING SEMICONDUCTOR CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →