Inventor · disambiguated record
Pao-Huei Chang Chien
Also filed as: CHANG CHIEN PAO-HUEI
5 granted patents·3 pending applications·279 citations·filing 2007–2010
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0196US7642133B2Method of making a semiconductor package and method of making a semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 5, 2010·183 cites·25 claims
- 0293US8120152B2Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereofCHANG CHIEN PAO-HUEI·Filed 2008·Granted Feb 21, 2012·26 cites·24 claims
- 0389US8106492B2Semiconductor package and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2009·Granted Jan 31, 2012·25 cites·21 claims
- 0488US8124447B2Manufacturing method of advanced quad flat non-leaded packageCHANG CHIEN PAO-HUEI·Filed 2009·Granted Feb 28, 2012·24 cites·29 claims
- 0587US8237250B2Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2009·Granted Aug 7, 2012·21 cites·20 claims
- 0649US2010044850A1Advanced quad flat non-leaded package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 0740US2008164595A1Stackable semiconductor package and the method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 0835US2012119342A1Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Pao-Huei Chang Chien files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →