Inventor · disambiguated record
Soon Lock Goh
Also filed as: GOH SOON LOCK
11 granted patents·5 pending applications·21 citations·filing 2007–2024
85Inventor score
Top patents by PatentIndex Score
16 records- 0184US10396007B2Semiconductor package with plateable encapsulant and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·4 cites·13 claims
- 0274US10431560B2Molded semiconductor package having an optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 1, 2019·2 cites·21 claims
- 0372US9806043B2Method of manufacturing molded semiconductor packages having an optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 31, 2017·2 cites·13 claims
- 0471US11081417B2Manufacturing a package using plateable encapsulantINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·1 cites·17 claims
- 0571US7955901B2Method for producing a power semiconductor module comprising surface-mountable flat external contactsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 7, 2011·6 cites·25 claims
- 0666US9852918B2Embedding additive particles in encapsulant of electronic deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 26, 2017·2 cites·22 claims
- 0764US8945990B2Chip package and method of forming the sameTORWESTEN HOLGER·Filed 2012·Granted Feb 3, 2015·2 cites·9 claims
- 0859US9287238B2Leadless semiconductor package with optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 15, 2016·1 cites·18 claims
- 0959US2025226297A1Package with carrier having plated bottom surface and sidewallINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1057US7838332B2Method of manufacturing a semiconductor package with a bump using a carrierINFINEON TECHNOLOGIES AG·Filed 2008·Granted Nov 23, 2010·1 cites·20 claims
- 1152US2020006267A1Molded Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 1251US2024006260A1Encapsulated package with exposed electrically conductive structures and sidewall recessINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1349US2024312956A1Subtractive Metal Structuring on Surface of Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1446US9540539B2Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 10, 2017·0 cites·14 claims
- 1539US2019027430A1Semiconductor package with nickel plating and method of fabrication thereofINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 1632US8304295B2Method of manufacturing an electronic device with a package locking systemGOH SOON LOCK·Filed 2010·Granted Nov 6, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →