Inventor · disambiguated record
Sayaka Hirafune
Also filed as: HIRAFUNE SAYAKA
3 granted patents·2 pending applications·154 citations·filing 2004–2010
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0193US7274101B2Semiconductor package and method for manufacturing the sameFUJIKURA LTD·Filed 2005·Granted Sep 25, 2007·42 cites·3 claims
- 0293US7180149B2Semiconductor package with through-holeOLYMPUS CORP·Filed 2004·Granted Feb 20, 2007·110 cites·11 claims
- 0360US7368321B2Semiconductor package and method for manufacturing the sameFUJIKURA LTD·Filed 2007·Granted May 6, 2008·2 cites·2 claims
- 0439US2006113057A1Metal filling process and metal filling apparatusFUJIKURA LTD·Filed 2006·Application pending·0 cites
- 0534US2010117220A1Semiconductor package and manufacturing method for the sameFUJIKURA LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →