Inventor · disambiguated record
Kazuya Kodani
Also filed as: KODANI KAZUYA
10 granted patents·9 pending applications·40 citations·filing 1999–2022
85Inventor score
Top patents by PatentIndex Score
19 records- 0188US9795049B2Semiconductor deviceTOSHIBA KK·Filed 2015·Granted Oct 17, 2017·9 cites·20 claims
- 0282US7129692B2Current detection equipment and semiconductor deviceTOSHIBA KK·Filed 2005·Granted Oct 31, 2006·10 cites·17 claims
- 0375US9123704B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2014·Granted Sep 1, 2015·4 cites·8 claims
- 0471US11888036B2Method for setting a nitrogen concentration of a silicon epitaxial film in manufacturing an epitaxial silicon waferSUMCO CORP·Filed 2022·Granted Jan 30, 2024·0 cites·5 claims
- 0560US8957522B2Semiconductor device and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2013·Granted Feb 17, 2015·1 cites·14 claims
- 0655US8558373B2Heatsink, heatsink assembly, semiconductor module, and semiconductor device with cooling deviceKODANI KAZUYA·Filed 2012·Granted Oct 15, 2013·1 cites·14 claims
- 0755US7105932B2Power semiconductor moduleTOSHIBA KK·Filed 2004·Granted Sep 12, 2006·7 cites·8 claims
- 0848US2020051817A1Epitaxial silicon wafer and method for manufacturing epitaxial silicon waferSUMCO CORP·Filed 2017·Application pending·0 cites
- 0946US10855196B2Semiconductor deviceTOSHIBA KK·Filed 2019·Granted Dec 1, 2020·0 cites·14 claims
- 1046US2015078414A1Method of testing semiconductor device and apparatus of testing semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1142US2015262959A1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1242US2015076516A1Semiconductor device and semiconductor moduleTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1341US2014284797A1Power semiconductor device fabrication method, power semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1440US10896867B2Terminal plate and semiconductor deviceTOSHIBA KK·Filed 2019·Granted Jan 19, 2021·0 cites·4 claims
- 1539US6166402APressure-contact type semiconductor element and power converter thereofTOSHIBA KK·Filed 1999·Granted Dec 26, 2000·8 cites·14 claims
- 1639US2003214313A1Current detection equipment and semiconductor deviceTOSHIBA KK·Filed 2003·Application pending·0 cites
- 1738US2013043594A1Method for manufacturing semiconductor device and semiconductor deviceTOSHIBA KK·Filed 2012·Application pending·0 cites
- 1835US2018233464A1Semiconductor moduleTOSHIBA KK·Filed 2017·Application pending·0 cites
- 1932US2016190032A1Wiring board and semiconductor package including wiring boardTOSHIBA KK·Filed 2015·Application pending·0 cites
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