Current detection equipment and semiconductor device

Abstract

A current detection equipment comprises a first coil and a second coil connected in series with the first coil. The current detection equipment is capable of detecting a current flowing through an object which is provided between the first and second coils or provided in a vicinity of the first or second coil. Each of the first and second coils having first conductive patterns provided on a surface of a substrate, a second conductive patterns provided on a back of the substrate and connecting parts which connect the first and second conductive patterns. A semiconductor device including the current detection equipment to measure the current flowing in a semiconductor element is also proposed.

What is claimed is:  
     
         1 . A current detection equipment comprising: 
 a first coil; and    a second coil connected in series with the first coil,    the current detection equipment being capable of detecting a current flowing through an object which is provided between the first and second coils or provided in a vicinity of the first or second coil, and    each of the first and second coils having first conductive patterns provided on a surface of a substrate, a second conductive patterns provided on a back of the substrate and connecting parts which connect the first and second conductive patterns.    
     
     
         2 . A current detection equipment according to  claim 1 , wherein the first and second coils are connected so that a voltage induced by a magnetic flux generated by the current flowing through the object in the first coil and a voltage induced by the magnetic flux generated by the current flowing through the object in the second coil are added.  
     
     
         3 . A current detection equipment comprising: 
 a substrate having a notch or a hole; and    a first and a second coils provided on opposite sides of the notch or the hole,    each of the first and second coils having first conductive patterns provided on a surface of the substrate, a second conductive patterns provided on a back of the substrate and connecting parts which connect the first and second conductive patterns.    
     
     
         4 . A current detection equipment according to  claim 3 , wherein the first and second coils are connected in series.  
     
     
         5 . A current detection equipment according to  claim 3 , wherein the first and second coils are connected so that a voltage induced by a magnetic flux generated by the current flowing through the object in the first coil and a voltage induced by the magnetic flux generated by the current flowing through the object in the second coil are added.  
     
     
         6 . A current detection equipment according to  claim 3 , wherein each of the connecting parts has a conductor which penetrates the substrate.  
     
     
         7 . A current detection equipment according to  claim 3 , wherein each of the connecting parts has a conductive pattern provided on a side surface of the substrate.  
     
     
         8 . A current detection equipment according to  claim 4 , wherein at least a part of a wiring which connects the first and second coils extends inside the substrate.  
     
     
         9 . A current detection equipment according to  claim 4 , further comprising a resistance connected in parallel to the first and second coils.  
     
     
         10 . A current detection equipment according to  claim 3 , further comprising a integration circuit connected to the first and second coils.  
     
     
         11 . A current detection equipment comprising: 
 a first substrate having a first coil;    a second substrate having a second coil; and    a spacer provided between the first and second substrates,    the first coil having first conductive patterns provided on a surface of the first substrate, a second conductive patterns provided on a back of the first substrate and connecting parts which connect the first and second conductive patterns,    the second coil having first conductive patterns provided on a surface of the second substrate, a second conductive patterns provided on a back of the second substrate and connecting parts which connect the first and second conductive patterns.    
     
     
         12 . A current detection equipment according to  claim 11 , wherein the first and second coils are connected in series.  
     
     
         13 . A current detection equipment according to  claim 11 , wherein the first and second coils are connected so that a voltage induced by a magnetic flux generated by the current flowing through the object in the first coil and a voltage induced by the magnetic flux generated by the current flowing through the object in the second coil are added.  
     
     
         14 . A current detection equipment according to  claim 11 , wherein each of the connecting parts has a conductor which penetrates the substrate.  
     
     
         15 . A current detection equipment according to  claim 11 , wherein each of the connecting parts has a conductive pattern provided on a side surface of the substrate.  
     
     
         16 . A current detection equipment according to  claim 12 , wherein at least a part of a wiring which connects the first and second coils extends inside the substrate.  
     
     
         17 . A current detection equipment according to  claim 12 , further comprising a resistance connected in parallel to the first and second coils.  
     
     
         18 . A current detection equipment according to  claim 11 , further comprising a integration circuit connected to the first and second coils.  
     
     
         19 . A semiconductor device comprising: 
 a semiconductor element; and    a current detection equipment including 
 a substrate having a notch or a hole; and  
 a first and a second coils provided on opposite sides of the notch or the hole,  
   each of the first and second coils having first conductive patterns provided on a surface of the substrate, a second conductive patterns provided on a back of the substrate and connecting parts which connect the first and second conductive patterns, and    at least a part of a current flowing in the semiconductor element being detected by the current detection equipment.    
     
     
         20 . A semiconductor device according to  claim 19 , wherein a bonding wire is connected to the semiconductor element, and the first and second coils are provided to sandwich the bonding wire.