Inventor · disambiguated record
Joseph M. Steigerwald
Also filed as: STEIGERWALD JOSEPH · STEIGERWALD JOSEPH M
37 granted patents·11 pending applications·501 citations·filing 1995–2025
98Inventor score
Top patents by PatentIndex Score
48 records- 0198US11887891B2Self-aligned contactsINTEL CORP·Filed 2023·Granted Jan 30, 2024·2 cites·20 claims
- 0298US8436404B2Self-aligned contactsBOHR MARK T·Filed 2009·Granted May 7, 2013·148 cites·30 claims
- 0397US9508821B2Self-aligned contactsINTEL CORP·Filed 2015·Granted Nov 29, 2016·13 cites·3 claims
- 0497US9466565B2Self-aligned contactsINTEL CORP·Filed 2015·Granted Oct 11, 2016·24 cites·18 claims
- 0597US9054178B2Self-aligned contactsBOHR MARK T·Filed 2014·Granted Jun 9, 2015·30 cites·12 claims
- 0697US9041146B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2013·Granted May 26, 2015·30 cites·24 claims
- 0795US9093513B2Self-aligned contactsBOHR MARK T·Filed 2013·Granted Jul 28, 2015·12 cites·14 claims
- 0893US11581419B2Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Feb 14, 2023·2 cites·21 claims
- 0992US11955534B2Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2022·Granted Apr 9, 2024·1 cites·20 claims
- 1092US9219155B2Multi-threshold voltage devices and associated techniques and configurationsINTEL CORP·Filed 2013·Granted Dec 22, 2015·9 cites·20 claims
- 1191US10930557B2Self-aligned contactsINTEL CORP·Filed 2020·Granted Feb 23, 2021·2 cites·12 claims
- 1291US10777655B2Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Sep 15, 2020·3 cites·22 claims
- 1391US9997563B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2017·Granted Jun 12, 2018·8 cites·24 claims
- 1491US5637185ASystems for performing chemical mechanical planarization and process for conducting sameRENSSELAER POLYTECH INST·Filed 1995·Granted Jun 10, 1997·118 cites·27 claims
- 1590US9876016B2Wrap-around trench contact structure and methods of fabricationSTEIGERWALD JOSEPH·Filed 2011·Granted Jan 23, 2018·13 cites·16 claims
- 1687US12266571B2Self-aligned contactsINTEL CORP·Filed 2023·Granted Apr 1, 2025·0 cites·16 claims
- 1786US10854731B2Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2019·Granted Dec 1, 2020·1 cites·20 claims
- 1886US10141226B2Self-aligned contactsINTEL CORP·Filed 2017·Granted Nov 27, 2018·2 cites·27 claims
- 1986US9660181B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2013·Granted May 23, 2017·7 cites·24 claims
- 2086US2024322037A1Multi-threshold voltage devices and associated techniques and configurationsSONY GROUP CORP·Filed 2024·Application pending·0 cites
- 2184US10644064B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2018·Granted May 5, 2020·4 cites·20 claims
- 2283US9972541B2Technique for filling high aspect ratio, narrow structures with multiple metal layers and associated configurationsINTEL CORP·Filed 2014·Granted May 15, 2018·5 cites·20 claims
- 2382US12426360B2Wrap-around trench contact structure and methods of fabricationINTEL CORP·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 2482US2025239486A1Self-aligned contactsINTEL CORP·Filed 2025·Application pending·0 cites
- 2581US11437511B2Multi-threshold voltage devices and associated techniques and configurationsSONY GROUP CORP·Filed 2020·Granted Sep 6, 2022·1 cites·19 claims
- 2681US8334184B2Polish to remove topography in sacrificial gate layer prior to gate patterningSTEIGERWALD JOSEPH M·Filed 2009·Granted Dec 18, 2012·10 cites·17 claims
- 2780US2025072078A1Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Application pending·0 cites
- 2879US12021141B2Multi-threshold voltage devices and associated techniques and configurationsSONY GROUP CORP·Filed 2022·Granted Jun 25, 2024·0 cites·15 claims
- 2976US11600524B2Self-aligned contactsINTEL CORP·Filed 2021·Granted Mar 7, 2023·0 cites·12 claims
- 3075US2024047556A1Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Application pending·0 cites
- 3173US6103625AUse of a polish stop layer in the formation of metal structuresINTEL CORP·Filed 1997·Granted Aug 15, 2000·47 cites·31 claims
- 3272US10861851B2Wrap-around trench contact structure and methods of fabricationINTEL CORP·Filed 2017·Granted Dec 8, 2020·1 cites·18 claims
- 3372US9761713B2Multi-threshold voltage devices and associated techniques and configurationsINTEL CORP·Filed 2015·Granted Sep 12, 2017·1 cites·23 claims
- 3472US8441097B2Methods to form memory devices having a capacitor with a recessed electrodeSTEIGERWALD JOSEPH M·Filed 2009·Granted May 14, 2013·5 cites·12 claims
- 3571US11776959B2Wrap-around trench contact structure and methods of fabricationINTEL CORP·Filed 2020·Granted Oct 3, 2023·0 cites·20 claims
- 3668US9565766B2Formation of DRAM capacitor among metal interconnectLINDERT NICK·Filed 2011·Granted Feb 7, 2017·2 cites·31 claims
- 3768US2020227472A1Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2020·Application pending·0 cites
- 3867US10629483B2Self-aligned contactsINTEL CORP·Filed 2018·Granted Apr 21, 2020·0 cites·20 claims
- 3962US9892967B2Self-aligned contactsINTEL CORP·Filed 2016·Granted Feb 13, 2018·0 cites·8 claims
- 4059US10573747B2Multi-threshold voltage devices and associated techniques and configurationsINTEL CORP·Filed 2016·Granted Feb 25, 2020·0 cites·15 claims
- 4148US2017148868A1Formation of dram capacitor among metal interconnectINTEL CORP·Filed 2017·Application pending·0 cites
- 4244US7052996B2Electrochemically polishing conductive films on semiconductor wafersINTEL CORP·Filed 2003·Granted May 30, 2006·0 cites·9 claims
- 4343US2011147851A1Method For Depositing Gate Metal For CMOS DevicesTHOMAS CHRISTOPHER D·Filed 2009·Application pending·0 cites
- 4441US2016225715A1Microelectronic transistor contacts and methods of fabricating the sameST AMOUR ANTHONY·Filed 2013·Application pending·0 cites
- 4541US2011147831A1Method for replacement metal gate fillSTEIGERWALD JOSEPH M·Filed 2009·Application pending·0 cites
- 4639US11476334B2Silicide structure of an integrated transistor device and method of providing sameINTEL CORP·Filed 2018·Granted Oct 18, 2022·0 cites·13 claims
- 4739US2014002976A1Recessed bottom-electrode capacitors and methods of assembling sameBRAIN RUTH A·Filed 2011·Application pending·0 cites
- 4837US2014001598A1Atomic layer deposition (ald) of taalc for capacitor integrationLINDERT NICK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →