Inventor · disambiguated record
Bonnie Ming-Yan Chan
Also filed as: CHAN BONNIE MING-YAN
2 granted patents·1 pending application·5 citations·filing 2007–2011
46Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0168US8008132B2Etched surface mount islands in a leadframe packageSANDISK TECHNOLOGIES INC·Filed 2007·Granted Aug 30, 2011·5 cites·28 claims
- 0241US8659133B2Etched surface mount islands in a leadframe packageUPADHYAYULA SURESH·Filed 2011·Granted Feb 25, 2014·0 cites·16 claims
- 0341US2009166820A1Tsop leadframe strip of multiply encapsulated packagesTAKIAR HEM·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →