Inventor · disambiguated record
Miki Hayashi
Also filed as: HAYASHI MIKI
9 granted patents·4 pending applications·40 citations·filing 1981–2022
85Inventor score
Files withHAYASHI MIKI3NICHIREI BIOSCIENCES INC3NITTO DENKO CORP2FUJITSU LTD1NIHON MEDIPHYSICS CO LTD1
Top patents by PatentIndex Score
13 records- 0175US7090872B2Antioxidant, skin preparation for external use, cosmetic and foodNICHIREI BIOSCIENCES INC·Filed 2003·Granted Aug 15, 2006·10 cites·5 claims
- 0274US7192617B2Whitening agent, skin preparation for external use and cosmeticNICHIREI BIOSCIENCES INC·Filed 2003·Granted Mar 20, 2007·10 cites·8 claims
- 0371US8779586B2Die bond film, dicing die bond film, and semiconductor deviceOONISHI KENJI·Filed 2011·Granted Jul 15, 2014·4 cites·15 claims
- 0463US7074907B2Compound, process for producing the same and use thereofNICHIREI BIOSCIENCES INC·Filed 2003·Granted Jul 11, 2006·2 cites·7 claims
- 0555US5189040APyrazole derivatives, method for producing the same and agricultural and/or horticultural fungicides containing the same as active ingredientSUMITOMO CHEMICAL CO·Filed 1991·Granted Feb 23, 1993·5 cites·12 claims
- 0651US8912665B2Dicing tape-integrated film for semiconductor back surfaceNITTO DENKO CORP·Filed 2012·Granted Dec 16, 2014·0 cites·4 claims
- 0746US4439413ARadioactive diagnostic agent for bone scanning and non-radioactive carrier thereforNIHON MEDIPHYSICS CO LTD·Filed 1981·Granted Mar 27, 1984·9 cites·16 claims
- 0845US2022228037A1Pressure-sensitive adhesive sheet for protecting semiconductor elementNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0939US2012153508A1Thermosetting die-bonding filmHAYASHI MIKI·Filed 2009·Application pending·0 cites
- 1038US10666721B2Resource management device and methodFUJITSU LTD·Filed 2017·Granted May 26, 2020·0 cites·13 claims
- 1138US8415201B2Dicing tape-integrated film for semiconductor back surfaceHAYASHI MIKI·Filed 2010·Granted Apr 9, 2013·0 cites·4 claims
- 1235US2010248072A1Fuel cellSHIDA NAOMI·Filed 2010·Application pending·0 cites
- 1326US2011057331A1Thermosetting die bonding film, dicing die bonding film and semiconductor deviceHAYASHI MIKI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →