Inventor · disambiguated record
William Gerard Vaillancourt
Also filed as: VAILLANCOURT WILLIAM · VAILLANCOURT WILLIAM GERARD
11 granted patents·4 pending applications·146 citations·filing 2005–2023
89Inventor score
Top patents by PatentIndex Score
15 records- 0193US7359677B2Device and methods for high isolation and interference suppression switch-filterSIGE SEMICONDUCTOR INC·Filed 2005·Granted Apr 15, 2008·31 cites·22 claims
- 0292US7445968B2Methods for integrated circuit module packaging and integrated circuit module packagesSIGE SEMICONDUCTOR U S CORP·Filed 2005·Granted Nov 4, 2008·90 cites·7 claims
- 0389US10211861B2Multi-mode integrated front end moduleSKYWORKS SOLUTIONS INC·Filed 2016·Granted Feb 19, 2019·10 cites·21 claims
- 0487US9425852B2Apparatus and methods for antenna sharing in a mobile deviceSKYWORKS SOLUTIONS INC·Filed 2016·Granted Aug 23, 2016·6 cites·20 claims
- 0587US9306526B2Low-loss high-isolation switching architectureSKYWORKS SOLUTIONS INC·Filed 2013·Granted Apr 5, 2016·8 cites·20 claims
- 0682US12399851B2Systems and methods related to configuring devices in a moduleSKYWORKS SOLUTIONS INC·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 0775US11822368B2Systems and methods related to configuring devices in a moduleSKYWORKS SOLUTIONS INC·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 0875US10635616B2Configuring devices in a moduleSKYWORKS SOLUTIONS INC·Filed 2016·Granted Apr 28, 2020·1 cites·20 claims
- 0972US2023245978A1Shielded wafer level chip scale package with shield connected to ground with vias through dieSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1072US2023245985A1Shielded wafer level chip scale package with shield connected to ground via redistribution layersSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1172US2023245979A1Shielded wafer level chip scale package with shield connected to ground via a seal ringSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1271US11636058B2Coupling and decoupling devices in a moduleSKYWORKS SOLUTIONS INC·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 1369US11263159B2Configuring devices in a moduleSKYWORKS SOLUTIONS INC·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 1459US10922254B2Coupling and decoupling devices in a moduleSKYWORKS SOLUTIONS INC·Filed 2016·Granted Feb 16, 2021·0 cites·20 claims
- 1549US2019229757A1Multi-mode integrated front end moduleSKYWORKS SOLUTIONS INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →