Inventor · disambiguated record
Nagesh Vodrahalli
Also filed as: VODRAHALLI NAGESH · VODRAHALLI NAGESH K
34 granted patents·13 pending applications·365 citations·filing 1996–2024
97Inventor score
Files withINTEL CORP15WESTERN DIGITAL TECH INC9SANDISK TECHNOLOGIES LLC5HICKMAN PAUL L3RIGETTI & CO INC3
Top patents by PatentIndex Score
47 records- 0196US11094674B2Memory scaling semiconductor deviceSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Aug 17, 2021·4 cites·20 claims
- 0296US10535809B1Substrate materials for quantum processorsRIGETTI & CO INC·Filed 2018·Granted Jan 14, 2020·30 cites·34 claims
- 0393US11121301B1Microwave integrated quantum circuits with cap wafers and their methods of manufactureRIGETTI & CO INC·Filed 2018·Granted Sep 14, 2021·21 cites·16 claims
- 0492US11004829B2Memory scaling semiconductor deviceSANDISK TECHNOLOGIES LLC·Filed 2019·Granted May 11, 2021·6 cites·16 claims
- 0589US12207569B1Microwave integrated quantum circuits with cap wafers and their methods of manufactureRIGETTI & CO LLC·Filed 2023·Granted Jan 21, 2025·1 cites·20 claims
- 0689US10985308B1Substrate materials for quantum processorsRIGETTI & CO INC·Filed 2020·Granted Apr 20, 2021·2 cites·18 claims
- 0787US6724078B1Electronic assembly comprising solderable thermal interfaceINTEL CORP·Filed 2000·Granted Apr 20, 2004·46 cites·52 claims
- 0886US11011500B2Memory scaling semiconductor deviceSANDISK TECHNOLOGIES LLC·Filed 2020·Granted May 18, 2021·2 cites·20 claims
- 0984US9870959B1Method and apparatus for testing a flip-chip assembly during manufactureALTERA CORP·Filed 2012·Granted Jan 16, 2018·6 cites·20 claims
- 1083US9040348B2Electronic assembly apparatus and associated methodsVODRAHALLI NAGESH·Filed 2012·Granted May 26, 2015·9 cites·23 claims
- 1182US7401986B2Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuitINTEL CORP·Filed 2006·Granted Jul 22, 2008·9 cites·19 claims
- 1281US9201097B1Method and apparatus for testing integrated circuit die with a partially completed and validated moduleALTERA CORP·Filed 2012·Granted Dec 1, 2015·5 cites·12 claims
- 1376US12430274B2Processing core including integrated high capacity high bandwidth storage memorySANDISK TECHNOLOGIES INC·Filed 2023·Granted Sep 30, 2025·0 cites·19 claims
- 1474US6778750B2Polarization-insensitive planar lightwave circuits and method for fabricating the sameINTEL CORP·Filed 2002·Granted Aug 17, 2004·14 cites·12 claims
- 1573US8057108B2Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuitBHOWMIK ACHINTYA K·Filed 2010·Granted Nov 15, 2011·3 cites·13 claims
- 1672US7780360B2Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuitINTEL CORP·Filed 2008·Granted Aug 24, 2010·4 cites·22 claims
- 1771US11444062B2Memory scaling semiconductor deviceSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Sep 13, 2022·0 cites·15 claims
- 1869US6228468B1High density ceramic BGA package and method for making sameHICKMAN PAUL L·Filed 1997·Granted May 8, 2001·29 cites·14 claims
- 1968US7099360B2Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuitINTEL CORP·Filed 2003·Granted Aug 29, 2006·12 cites·17 claims
- 2068US6490166B1Integrated circuit package having a substrate vent holeINTEL CORP·Filed 1999·Granted Dec 3, 2002·30 cites·16 claims
- 2167US11770982B1Microwave integrated quantum circuits with cap wafers and their methods of manufactureRIGETTI & CO LLC·Filed 2021·Granted Sep 26, 2023·0 cites·12 claims
- 2266US6860642B2Compact optical package with modular optical connectorINTEL CORP·Filed 2002·Granted Mar 1, 2005·12 cites·14 claims
- 2365US7091063B2Electronic assembly comprising solderable thermal interface and methods of manufactureINTEL CORP·Filed 2004·Granted Aug 15, 2006·11 cites·25 claims
- 2463US2025254893A1Processing core including high capacity low latency storage memorySANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2562US2025259969A1High bandwidth non-volatile memorySANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 2660US6331446B1Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel stateINTEL CORP·Filed 1999·Granted Dec 18, 2001·25 cites·35 claims
- 2759US5903436AEmulative lid/heatspreader for processor die attached to an organic substrateINTEL CORP·Filed 1997·Granted May 11, 1999·28 cites·20 claims
- 2859US2025293205A1Processing core including integrated high capacity high bandwidth storage memoryWESTERN DIGITAL TECH INC·Filed 2024·Application pending·0 cites
- 2958US2025309196A1Embedded aligned fiducial markers for stacked fanout semiconductor deviceWESTERN DIGITAL TECH INC·Filed 2024·Application pending·0 cites
- 3058US2025239510A1High capacity high bandwidth non-volatile memory deviceSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 3155US2025006701A1Semiconductor die stacking architecture and connection method thereforeWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 3254US6982192B1High performance thermal interface curing process for organic flip chip packagesINTEL CORP·Filed 1999·Granted Jan 3, 2006·16 cites·18 claims
- 3353US6928200B2Ultra-thin polarization mode converters based on liquid crystal materialsINTEL CORP·Filed 2002·Granted Aug 9, 2005·3 cites·20 claims
- 3453US6879743B2Crystal-core fiber mode converter for low-loss polarization-insensitive planar lightwave circuitsINTEL CORP·Filed 2001·Granted Apr 12, 2005·3 cites·21 claims
- 3553US5948140AMethod and system for extracting and refining gold from oresHICKMAN PAUL L·Filed 1996·Granted Sep 7, 1999·9 cites·21 claims
- 3652US2024312916A1Semiconductor Device Package with Die Stackup and InterposerWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 3752US2024213151A1Tsv semiconductor device including inductive compensation loopsWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 3851US6248951B1Dielectric decal for a substrate of an integrated circuit packageINTEL CORP·Filed 1999·Granted Jun 19, 2001·17 cites·20 claims
- 3951US2024145424A1Nand die with wire-bond inductive compensation for altered bond wire bandwidth in memory devicesWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 4051US2023395438A1Semiconductor device including select dies of known thicknessesWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 4150US2025089271A1Memory die stack having a switch for selectively connecting a memory die to a substrateWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 4249USRE44629EProcess for assembling an integrated circuit package having a substrate vent holeRAMALINGAM SURESH·Filed 2004·Granted Dec 10, 2013·5 cites·16 claims
- 4348US10811392B2TSV semiconductor device including two-dimensional shiftWESTERN DIGITAL TECH INC·Filed 2019·Granted Oct 20, 2020·0 cites·22 claims
- 4445US7174060B2Ultra-thin polarization mode converters based on liquid crystal materialsINTEL CORP·Filed 2005·Granted Feb 6, 2007·0 cites·16 claims
- 4545US2024387461A1Semiconductor Device Package with Die Stackup and Connection PlatformWESTER DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 4640US2005141806A1Multiplexing and demultiplexing optical signalsFiled 2003·Application pending·0 cites
- 4739US6090341AMethod and system for extracting and refining gold from oresHICKMAN PAUL L·Filed 1997·Granted Jul 18, 2000·3 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →