Inventor · disambiguated record
William Stone
Also filed as: STONE WILLIAM · STONE WILLIAM B · STONE WILLIAM J III · STONE WILLIAM JEFFERSON
21 granted patents·17 pending applications·470 citations·filing 1979–2024
96Inventor score
Files withQUALCOMM INC15TEMPTRONIC CORP9BELOIT TECHNOLOGIES INC2XETEL CORP2LEYBOLD HERAEUS GMBH & CO KG1
Top patents by PatentIndex Score
38 records- 0190US6700099B2Wafer chuck having thermal plate with interleaved heating and cooling elements, interchangeable top surface assemblies and hard coated layer surfacesTEMPTRONIC CORP·Filed 2001·Granted Mar 2, 2004·43 cites·23 claims
- 0290US4346453AItem display order picking systemSCOPE INC·Filed 1979·Granted Aug 24, 1982·48 cites·3 claims
- 0387US10002857B2Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layerQUALCOMM INC·Filed 2016·Granted Jun 19, 2018·10 cites·34 claims
- 0486US5644839ASurface mountable substrate edge terminalXETEL CORP·Filed 1995·Granted Jul 8, 1997·56 cites·18 claims
- 0584US10347592B2Integrated circuit (IC) devices with varying diameter via layerQUALCOMM INC·Filed 2017·Granted Jul 9, 2019·3 cites·30 claims
- 0684US4677273AElectron beam welding apparatusLEYBOLD HERAEUS GMBH & CO KG·Filed 1986·Granted Jun 30, 1987·43 cites·16 claims
- 0783US12218041B2Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methodsQUALCOMM INC·Filed 2021·Granted Feb 4, 2025·1 cites·20 claims
- 0881US5213649AApparatus for receiving and cutting a continuous webBELOIT TECHNOLOGIES INC·Filed 1990·Granted May 25, 1993·35 cites·6 claims
- 0979US6744270B2Temperature-controlled thermal platform for automated testingTEMPTRONIC CORP·Filed 2001·Granted Jun 1, 2004·19 cites·16 claims
- 1079US5509197AMethod of making substrate edge connectorXETEL CORP·Filed 1994·Granted Apr 23, 1996·39 cites·13 claims
- 1176US7331097B2Method of manufacturing a workpiece chuckTEMPTRONIC CORP·Filed 2004·Granted Feb 19, 2008·16 cites·3 claims
- 1276US2025118645A1Integrated circuit (ic) packages employing a capacitor-embedded, redistribution layer (rdl) substrate for interfacing an ic chip(s) to a package substrate, and related methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1375US6019164AWorkpiece chuckTEMPTRONIC CORP·Filed 1998·Granted Feb 1, 2000·44 cites·42 claims
- 1474US6328096B1Workpiece chuckTEMPTRONIC CORP·Filed 1999·Granted Dec 11, 2001·37 cites·19 claims
- 1573US2025391755A1Package comprising dummy silicon structure located between integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1671US6375176B1Workpiece chuck with guard layer having vacuum distribution patternTEMPTRONIC CORP·Filed 1999·Granted Apr 23, 2002·35 cites·8 claims
- 1766US6867611B2Temperature-controlled thermal platform for automated testingTEMPTRONIC CORP·Filed 2004·Granted Mar 15, 2005·8 cites·22 claims
- 1864US9318405B2Wafer level package without sidewall crackingQUALCOMM INC·Filed 2015·Granted Apr 19, 2016·1 cites·20 claims
- 1961US6132583AShielding method and apparatus for use in electroplating processTECHNIC·Filed 1997·Granted Oct 17, 2000·22 cites·17 claims
- 2061US2025343176A1Package comprising an interposer package with metallization portions, and a passive device and a bridge between the metallization portionsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2158US10483218B2Integrated circuit (IC) devices with varying diameter via layerQUALCOMM INC·Filed 2019·Granted Nov 19, 2019·0 cites·20 claims
- 2257US2025069965A1Package comprising a substrate with an embedded frameQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2357US2025357448A1Package comprising a passive device with a front side protection layerQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2454US2024071993A1Package comprising a chiplet located between two metallization portionsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2554US2024072032A1Package comprising a chiplet located between an integrated device and a metallization portionQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2653US2005200251A1Method and apparatus for movable structure having alternative accessible sidesFiled 2005·Application pending·0 cites
- 2751US2020085671A1Physical obstruction of scalp arterial circulation to prevent chemotherapy associated alopeciaMAYO FOUND MEDICAL EDUCATION & RES·Filed 2019·Application pending·0 cites
- 2850US11784157B2Package comprising integrated devices coupled through a metallization layerQUALCOMM INC·Filed 2021·Granted Oct 10, 2023·0 cites·33 claims
- 2950US5878975AWinder rider roll assemblyBELOIT TECHNOLOGIES INC·Filed 1997·Granted Mar 9, 1999·9 cites·19 claims
- 3049US2005067925A1Method and apparatus for movable structure having alternative accessible sidesFiled 2004·Application pending·0 cites
- 3149US2005217583A1Wafer chuck having thermal plate with interleaved heating and cooling elementsTEMPTRONIC CORP·Filed 2005·Application pending·0 cites
- 3247US6969830B2Wafer chuck having thermal plate with interleaved heating and cooling elementsTEMPTRONIC CORP·Filed 2003·Granted Nov 29, 2005·1 cites·20 claims
- 3347US2021375845A1Package cavity for enhanced device performance with an integrated passive deviceQUALCOMM INC·Filed 2020·Application pending·0 cites
- 3445US2007011886A1Wallboard cuttting method and deviceSTONE WILLIAM B·Filed 2005·Application pending·0 cites
- 3543US2007205981A1Media device having alternatively accessible sidesSTONE WILLIAM J III·Filed 2006·Application pending·0 cites
- 3638US2002066551A1Workpiece chuckFiled 2001·Application pending·0 cites
- 3736US2003006062A1Interconnect system and method of fabricationFiled 2001·Application pending·0 cites
- 3833US2017271175A1Exposed die mold underfill (muf) with fine pitch copper (cu) pillar assembly and bump densityQUALCOMM INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →