Assignee
TEMPTRONIC CORP
US·31 granted patents·7 pending applications·1,357 citations·filing 1981–2019
Top patents by PatentIndex Score
38 records- 0193US4491173ARotatable inspection tableTEMPTRONIC CORP·Filed 1982·Granted Jan 1, 1985·152 cites·17 claims
- 0293US4426619AElectrical testing system including plastic window test chamber and method of using sameTEMPTRONIC CORP·Filed 1981·Granted Jan 17, 1984·113 cites·8 claims
- 0392US6415858B1Temperature control system for a workpiece chuckTEMPTRONIC CORP·Filed 1997·Granted Jul 9, 2002·127 cites·43 claims
- 0492US4734872ATemperature control for device under testTEMPTRONIC CORP·Filed 1985·Granted Mar 29, 1988·148 cites·17 claims
- 0591US6540014B2Workpiece chuckTEMPTRONIC CORP·Filed 2000·Granted Apr 1, 2003·55 cites·20 claims
- 0690US6700099B2Wafer chuck having thermal plate with interleaved heating and cooling elements, interchangeable top surface assemblies and hard coated layer surfacesTEMPTRONIC CORP·Filed 2001·Granted Mar 2, 2004·43 cites·23 claims
- 0790US6091060APower and control system for a workpiece chuckTEMPTRONIC CORP·Filed 1997·Granted Jul 18, 2000·111 cites·38 claims
- 0888US4784213AMixing valve air sourceTEMPTRONIC CORP·Filed 1986·Granted Nov 15, 1988·96 cites·18 claims
- 0984US6073681AWorkpiece chuckTEMPTRONIC CORP·Filed 1997·Granted Jun 13, 2000·64 cites·38 claims
- 1083US7629533B2Temperature-controlled enclosures and temperature control system using the sameTEMPTRONIC CORP·Filed 2007·Granted Dec 8, 2009·12 cites·4 claims
- 1180US6802368B2Temperature control system for a workpiece chuckTEMPTRONIC CORP·Filed 2002·Granted Oct 12, 2004·20 cites·18 claims
- 1280US6552561B2Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diodeTEMPTRONIC CORP·Filed 2001·Granted Apr 22, 2003·39 cites·25 claims
- 1380US4759712ADevice for applying controlled temperature stimuli to nerve sensitive tissueTEMPTRONIC CORP·Filed 1986·Granted Jul 26, 1988·65 cites·26 claims
- 1479US6744270B2Temperature-controlled thermal platform for automated testingTEMPTRONIC CORP·Filed 2001·Granted Jun 1, 2004·19 cites·16 claims
- 1578US6886347B2Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modulesTEMPTRONIC CORP·Filed 2003·Granted May 3, 2005·32 cites·46 claims
- 1678US6866094B2Temperature-controlled chuck with recovery of circulating temperature control fluidTEMPTRONIC CORP·Filed 2001·Granted Mar 15, 2005·31 cites·10 claims
- 1776US7331097B2Method of manufacturing a workpiece chuckTEMPTRONIC CORP·Filed 2004·Granted Feb 19, 2008·16 cites·3 claims
- 1875US6019164AWorkpiece chuckTEMPTRONIC CORP·Filed 1998·Granted Feb 1, 2000·44 cites·42 claims
- 1974US6328096B1Workpiece chuckTEMPTRONIC CORP·Filed 1999·Granted Dec 11, 2001·37 cites·19 claims
- 2071US6375176B1Workpiece chuck with guard layer having vacuum distribution patternTEMPTRONIC CORP·Filed 1999·Granted Apr 23, 2002·35 cites·8 claims
- 2170US6545494B1Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diodeTEMPTRONIC CORP·Filed 2000·Granted Apr 8, 2003·23 cites·37 claims
- 2266US6867611B2Temperature-controlled thermal platform for automated testingTEMPTRONIC CORP·Filed 2004·Granted Mar 15, 2005·8 cites·22 claims
- 2364US6033107ATemperature mapping systemTEMPTRONIC CORP·Filed 1998·Granted Mar 7, 2000·34 cites·40 claims
- 2461US11231455B2System and method for controlling temperature at test sitesTEMPTRONIC CORP·Filed 2019·Granted Jan 25, 2022·0 cites·12 claims
- 2560US6745575B2Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modulesTEMPTRONIC CORP·Filed 2002·Granted Jun 8, 2004·9 cites·22 claims
- 2657US6505478B1Heat exchanger having sloped deflection surface for directing refrigerantTEMPTRONIC CORP·Filed 2000·Granted Jan 14, 2003·6 cites·45 claims
- 2754US10060668B2Temperature-controlled enclosures and temperature control system using the sameTEMPTRONIC CORP·Filed 2013·Granted Aug 28, 2018·0 cites·55 claims
- 2853US2008231304A1Apparatus and method for controlling temperature in a chuck systemTEMPTRONIC CORP·Filed 2008·Application pending·0 cites
- 2953US2008188990A1Apparatus and method for controlling temperature in a chuck systemTEMPTRONIC CORP·Filed 2008·Application pending·0 cites
- 3052US2020124219A1Apparatus for attachment of accessories to processing equipmentTEMPTRONIC CORP·Filed 2019·Application pending·0 cites
- 3151US10731903B2System and method for device under test cooling using digital scroll compressorTEMPTRONIC CORP·Filed 2018·Granted Aug 4, 2020·0 cites·16 claims
- 3249US2005217583A1Wafer chuck having thermal plate with interleaved heating and cooling elementsTEMPTRONIC CORP·Filed 2005·Application pending·0 cites
- 3347US6969830B2Wafer chuck having thermal plate with interleaved heating and cooling elementsTEMPTRONIC CORP·Filed 2003·Granted Nov 29, 2005·1 cites·20 claims
- 3444US6070413ACondensation-free apparatus and method for transferring low-temperature fluidTEMPTRONIC CORP·Filed 1998·Granted Jun 6, 2000·17 cites·36 claims
- 3543US2009100945A1Apparatus and method for self-aligning a thermal cap and for connecting to a source of temperature-controlled fluidTEMPTRONIC CORP·Filed 2007·Application pending·0 cites
- 3641US10578237B2Apparatus for attachment of accessories to processing equipmentTEMPTRONIC CORP·Filed 2016·Granted Mar 3, 2020·0 cites·8 claims
- 3735US2005121186A1Apparatus and method for reducing electrical noise in a thermally controlled chuckTEMPTRONIC CORP·Filed 2004·Application pending·0 cites
- 3835US2017261547A1Temperature Forcing System and Method with Conductive Thermal ProbesTEMPTRONIC CORP·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when TEMPTRONIC CORP files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →