Inventor · disambiguated record
Ajit Sathe
Also filed as: SATHE AJIT · SATHE AJIT V
14 granted patents·3 pending applications·564 citations·filing 2000–2011
95Inventor score
Top patents by PatentIndex Score
17 records- 0195US6840777B2Solderless electronics packagingINTEL CORP·Filed 2000·Granted Jan 11, 2005·68 cites·34 claims
- 0292US6661660B2Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachmentINTEL CORP·Filed 2001·Granted Dec 9, 2003·72 cites·17 claims
- 0391US6639799B2Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachmentINTEL CORP·Filed 2000·Granted Oct 28, 2003·67 cites·8 claims
- 0490US6535386B2Electronic assembly having a heat pipe that conducts heat from a semiconductor dieINTEL CORP·Filed 2000·Granted Mar 18, 2003·78 cites·35 claims
- 0590US6469893B1Direct heatpipe attachment to die using center point loadingINTEL CORP·Filed 2000·Granted Oct 22, 2002·53 cites·41 claims
- 0687US6625022B2Direct heatpipe attachment to die using center point loadingINTEL CORP·Filed 2001·Granted Sep 23, 2003·40 cites·18 claims
- 0783US7159313B2Solderless electronics packaging and methods of manufactureINTEL CORP·Filed 2004·Granted Jan 9, 2007·23 cites·34 claims
- 0883US7045890B2Heat spreader and stiffener having a stiffener extensionINTEL CORP·Filed 2001·Granted May 16, 2006·35 cites·67 claims
- 0983US6800947B2Flexible tape electronics packagingINTEL CORP·Filed 2001·Granted Oct 5, 2004·26 cites·15 claims
- 1082US7253523B2Reworkable thermal interface materialINTEL CORP·Filed 2003·Granted Aug 7, 2007·28 cites·29 claims
- 1181US6703697B2Electronic package design with improved power delivery performanceINTEL CORP·Filed 2001·Granted Mar 9, 2004·40 cites·29 claims
- 1279US6903278B2Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrateINTEL CORP·Filed 2001·Granted Jun 7, 2005·27 cites·27 claims
- 1365US8952511B2Integrated circuit package having bottom-side stiffenerSATHE AJIT V·Filed 2007·Granted Feb 10, 2015·6 cites·9 claims
- 1457US7589395B2Multiple-dice packages using elements between dice to control application of underfill material to reduce void formationINTEL CORP·Filed 2006·Granted Sep 15, 2009·1 cites·18 claims
- 1543US2005017345A1Flexible tape electronics packaging and methods of manufactureINTEL CORP·Filed 2004·Application pending·0 cites
- 1637US2013005162A1Multiple socket conceptMALLIK DEBENDRA·Filed 2011·Application pending·0 cites
- 1735US2005287986A1System and method for securing mobile equipmentSATHE AJIT V·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →