Inventor · disambiguated record
Tong Qing Chen
Also filed as: CHEN TONG QING
9 granted patents·1 pending application·308 citations·filing 2003–2014
89Inventor score
Files withCHARTERED SEMICONDUCTOR MFG4SAMSUNG ELECTRONICS CO LTD2GLOBALFOUNDRIES INC1MEHTA SOHAN1YELEHANKA PRADEEP RAMACHANDRAMURTHY1
Top patents by PatentIndex Score
10 records- 0194US6884712B2Method of manufacturing semiconductor local interconnect and contactCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Apr 26, 2005·233 cites·10 claims
- 0293US7524755B2Entire encapsulation of Cu interconnects using self-aligned CuSiN filmCHARTERED SEMICONDUCTOR MFG·Filed 2006·Granted Apr 28, 2009·37 cites·18 claims
- 0380US7488687B2Methods of forming electrical interconnect structures using polymer residues to increase etching selectivity through dielectric layersSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 10, 2009·7 cites·20 claims
- 0477US7553758B2Method of fabricating interconnections of microelectronic device using dual damascene processSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 30, 2009·7 cites·17 claims
- 0576US7803704B2Reliable interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2008·Granted Sep 28, 2010·6 cites·20 claims
- 0675US8932961B2Critical dimension and pattern recognition structures for devices manufactured using double patterning techniquesMEHTA SOHAN·Filed 2012·Granted Jan 13, 2015·5 cites·4 claims
- 0775US8102054B2Reliable interconnectsZHANG BEI CHAO·Filed 2010·Granted Jan 24, 2012·5 cites·20 claims
- 0870US8304834B2Semiconductor local interconnect and contactYELEHANKA PRADEEP RAMACHANDRAMURTHY·Filed 2006·Granted Nov 6, 2012·6 cites·5 claims
- 0960US7119005B2Semiconductor local interconnect and contactCHARTERED SEMICONDUCTOR MFG·Filed 2005·Granted Oct 10, 2006·2 cites·5 claims
- 1052US2015050811A1Critical dimension and pattern recognition structures for devices manufactured using double patterning techniquesGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →