Inventor · disambiguated record
Takehiko Maeda
Also filed as: MAEDA TAKEHIKO
19 granted patents·12 pending applications·296 citations·filing 2001–2023
93Inventor score
Top patents by PatentIndex Score
31 records- 0196US6762488B2Light thin stacked package semiconductor device and process for fabrication thereofNEC ELECTRONICS CORP·Filed 2003·Granted Jul 13, 2004·222 cites·18 claims
- 0287US7838779B2Wiring board, method for manufacturing same, and semiconductor packageNEC CORP·Filed 2006·Granted Nov 23, 2010·16 cites·11 claims
- 0386US7745736B2Interconnecting substrate and semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Jun 29, 2010·15 cites·28 claims
- 0485US8035217B2Semiconductor device and method for manufacturing sameNEC CORP·Filed 2008·Granted Oct 11, 2011·9 cites·20 claims
- 0583US7649749B2Wiring substrate, semiconductor device, and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2007·Granted Jan 19, 2010·10 cites·26 claims
- 0680US7911038B2Wiring board, semiconductor device using wiring board and their manufacturing methodsRENESAS ELECTRONICS CORP·Filed 2007·Granted Mar 22, 2011·7 cites·18 claims
- 0774US7999401B2Semiconductor device and method of manufacturing sameNEC CORP·Filed 2008·Granted Aug 16, 2011·6 cites·20 claims
- 0873US9853005B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Dec 26, 2017·2 cites·6 claims
- 0967US8536691B2Semiconductor device and method for manufacturing the sameKIKUCHI KATSUMI·Filed 2007·Granted Sep 17, 2013·4 cites·25 claims
- 1063US10181450B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Jan 15, 2019·1 cites·8 claims
- 1163US7674989B2Wiring board and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Mar 9, 2010·2 cites·23 claims
- 1259US7701726B2Method of manufacturing a wiring substrate and semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Granted Apr 20, 2010·1 cites·10 claims
- 1358US8043953B2Semiconductor device including an LSI chip and a method for manufacturing the sameNEC CORP·Filed 2008·Granted Oct 25, 2011·1 cites·7 claims
- 1455US2023369179A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1554US8389414B2Method of manufacturing a wiring boardKIKUCHI KATSUMI·Filed 2011·Granted Mar 5, 2013·0 cites·30 claims
- 1653US2010105170A1Method for manufacturing a semiconductor device having a heat spreaderNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1752US2010117244A1Semiconductor device and manufacturing method thereforNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1850US9299632B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 29, 2016·0 cites·14 claims
- 1950US8975150B2Semiconductor device manufacturing methodMORI KENTARO·Filed 2011·Granted Mar 10, 2015·0 cites·13 claims
- 2049US2013127050A1Semiconductor device and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 2148US10895373B1Light projection deviceUSHIO LIGHTING INC·Filed 2018·Granted Jan 19, 2021·0 cites·8 claims
- 2248US2018068964A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 2348US2013005090A1Method for manufacturing a semiconductor device having a heat spreaderSATO YUKO·Filed 2012·Application pending·0 cites
- 2446US2011104872A1Method of manufacturing a semiconductor device having a heat spreaderRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 2545US9659888B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted May 23, 2017·0 cites·9 claims
- 2645US2010232127A1Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2744US2008272829A1Semiconductor device including multilayer wiring board with power supply circuitNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2841US11270971B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Mar 8, 2022·0 cites·3 claims
- 2939US2003166314A1Resin encapsulated BGA-type semiconductor deviceFiled 2003·Application pending·0 cites
- 3038US2003107129A1Resin encapsulated BGA-type semiconductor deviceNEC CORP·Filed 2001·Application pending·0 cites
- 3134US2003119296A1Semiconductor device and manufacturing method for the sameFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →