Inventor · disambiguated record
Erica Porras
Also filed as: PORRAS ERICA · PORRAS ERICA R · PORRAS ERICA RENEE
11 granted patents·4 pending applications·64 citations·filing 2003–2008
89Inventor score
Top patents by PatentIndex Score
15 records- 0189US7559527B2Diffusion bonded fluid flow manifold with partially integrated inter-active componentAPPLIED MATERIALS INC·Filed 2007·Granted Jul 14, 2009·5 cites·9 claims
- 0289US7448276B2Capacitance dual electrode pressure sensor in a diffusion bonded layered substrateAPPLIED MATERIALS INC·Filed 2006·Granted Nov 11, 2008·15 cites·16 claims
- 0388US8020750B2Method of attaching components to fluid delivery systems using diffusion bondingAPPLIED MATERIALS INC·Filed 2006·Granted Sep 20, 2011·5 cites·10 claims
- 0488US7459003B2In-line filter in a diffusion bonded layered substrateAPPLIED MATERIALS INC·Filed 2006·Granted Dec 2, 2008·14 cites·17 claims
- 0586US7497026B2Method and system for detection of wafer centering in a track lithography toolSOKUDO CO LTD·Filed 2007·Granted Mar 3, 2009·14 cites·18 claims
- 0680US7984891B2Manufacture of an integrated fluid delivery system for semiconductor processing apparatusAPPLIED MATERIALS INC·Filed 2007·Granted Jul 26, 2011·2 cites·16 claims
- 0774US7517469B2Method and system to measure flow velocity and volumeSOKUDO CO LTD·Filed 2006·Granted Apr 14, 2009·4 cites·14 claims
- 0872US7935948B2Method and apparatus for monitoring and control of suck back level in a photoresist dispense systemSOKUDO CO LTD·Filed 2007·Granted May 3, 2011·4 cites·12 claims
- 0961US7850786B2Method of improving corrosion resistance of stainless steel surfaces by a process of passivationAPPLIED MATERIALS INC·Filed 2006·Granted Dec 14, 2010·0 cites·16 claims
- 1054US8017028B2Method of increasing etchability of metals having chemical etching resistant microstructureAPPLIED MATERIALS INC·Filed 2008·Granted Sep 13, 2011·0 cites·12 claims
- 1150US7567885B2Method and system for determining object heightSOKUDO CO LTD·Filed 2007·Granted Jul 28, 2009·1 cites·24 claims
- 1246US2009179366A1Apparatus for supporting a substrate during semiconductor processing operationsSOKUDO CO LTD·Filed 2008·Application pending·0 cites
- 1345US2008153182A1Method and system to measure and compensate for substrate warpage during thermal processingSOKUDO CO LTD·Filed 2007·Application pending·0 cites
- 1444US2008160462A1Method and system for bake plate heat transfer control in track lithography toolsSOKUDO CO LTD·Filed 2007·Application pending·0 cites
- 1540US2004119038A1Micromachined integrated fluid delivery system with dynamic metal seat valve and other componentsAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Erica Porras files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →